Suchergebnisse für "ae1005" : 20

Art der Ansicht :
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
ohne MwSt
A-CCS 028-Z-T A-CCS 028-Z-T Assmann WSW Components ASS_0981_CO.pdf Description: CONN SOCKET PLCC 28POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (4 x 7)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 136 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.31 EUR
10+ 1.95 EUR
33+ 1.87 EUR
66+ 1.83 EUR
132+ 1.75 EUR
Mindestbestellmenge: 8
A-CCS 044-Z-T A-CCS 044-Z-T Assmann WSW Components ASS_0981_CO.pdf Description: CONN SOCKET PLCC 44POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 44 (4 x 11)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 3867 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.6 EUR
10+ 2.25 EUR
25+ 2.16 EUR
50+ 2.11 EUR
100+ 2.02 EUR
250+ 1.82 EUR
500+ 1.68 EUR
1000+ 1.44 EUR
2500+ 1.34 EUR
Mindestbestellmenge: 7
A-CCS 068-Z-T A-CCS 068-Z-T Assmann WSW Components ASS_0981_CO.pdf Description: CONN SOCKET PLCC 68POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 963 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.36 EUR
19+ 2.93 EUR
38+ 2.8 EUR
57+ 2.74 EUR
114+ 2.62 EUR
266+ 2.37 EUR
513+ 2.18 EUR
Mindestbestellmenge: 6
AR 20-HZW/TN AR 20-HZW/TN Assmann WSW Components ASS_6290_CO.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
auf Bestellung 623 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.59 EUR
24+ 3.13 EUR
48+ 2.93 EUR
120+ 2.8 EUR
264+ 2.53 EUR
504+ 2.33 EUR
Mindestbestellmenge: 5
DSC1033AE1-005.0000 DSC1033AE1-005.0000 Microchip Technology DSC1033%20Datasheet%20MKQBPD0318091-7.pdf Description: MEMS OSC XO 5.0000MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1033AE1-005.0000T DSC1033AE1-005.0000T Microchip Technology DSC1033%20Datasheet%20MKQBPD0318091-7.pdf Description: MEMS OSC XO 5.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1122AE1-005.0000 DSC1122AE1-005.0000 Microchip Technology DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254A.pdf Description: MEMS OSC XO 5.0000MHZ LVPECL SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1122AE1-005.0000 DSC1122AE1-005.0000 Microchip Technology DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254A.pdf Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5
Packaging: Tube
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1122AE1-005.0000 DSC1122AE1-005.0000 Microchip Technology DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254A.pdf Standard Clock Oscillators MEMS OSC, PECL, 5MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Produkt ist nicht verfügbar
DSC1122AE1-005.0000T DSC1122AE1-005.0000T Microchip Technology DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254A.pdf Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1122AE1-005.0000T DSC1122AE1-005.0000T Microchip Technology DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254A.pdf Standard Clock Oscillators MEMS OSC, PECL, 5MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Produkt ist nicht verfügbar
SI5386A-E10051-GM SI5386A-E10051-GM Skyworks Solutions, Inc. si5386_datasheet-2507566.pdf Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Produkt ist nicht verfügbar
SI5386A-E10051-GMR SI5386A-E10051-GMR Skyworks Solutions, Inc. si5386_datasheet-2507566.pdf Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Produkt ist nicht verfügbar
A-CCS20-Z-R A-CCS20-Z-R Assmann WSW Components A-CCSxx-x-R_REV00_Dwg.pdf Description: CONN SOCKET PLCC 20POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (4 x 5)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
A-CCS32-Z-R A-CCS32-Z-R Assmann WSW Components A-CCSxx-x-R_REV00_Dwg.pdf Description: CONN SOCKET PLCC 32POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
A-CCS52-Z-R A-CCS52-Z-R Assmann WSW Components A-CCSxx-x-R_REV00_Dwg.pdf Description: CONN SOCKET PLCC 52POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 52 (4 x 13)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
AK430-3 AK430-3 Assmann WSW Components Description: CABLE CENTRONICS M-F 3M
Packaging: Bulk
Length: 9.84' (3.00m)
Shielding: Shielded
Style: Bidirectional
Configuration: Centronics 36 pos Female to Male
Cable Type: Round, Beige
Produkt ist nicht verfügbar
AR 24-HZW/TN AR 24-HZW/TN Assmann WSW Components ASS_3579_CO.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 28-HZW/TN AR 28-HZW/TN Assmann WSW Components ASS_3579_CO.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 40-HZW/TN AR 40-HZW/TN Assmann WSW Components ASS_3580_CO.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
A-CCS 028-Z-T ASS_0981_CO.pdf
A-CCS 028-Z-T
Hersteller: Assmann WSW Components
Description: CONN SOCKET PLCC 28POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (4 x 7)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 136 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8+2.31 EUR
10+ 1.95 EUR
33+ 1.87 EUR
66+ 1.83 EUR
132+ 1.75 EUR
Mindestbestellmenge: 8
A-CCS 044-Z-T ASS_0981_CO.pdf
A-CCS 044-Z-T
Hersteller: Assmann WSW Components
Description: CONN SOCKET PLCC 44POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 44 (4 x 11)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 3867 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
7+2.6 EUR
10+ 2.25 EUR
25+ 2.16 EUR
50+ 2.11 EUR
100+ 2.02 EUR
250+ 1.82 EUR
500+ 1.68 EUR
1000+ 1.44 EUR
2500+ 1.34 EUR
Mindestbestellmenge: 7
A-CCS 068-Z-T ASS_0981_CO.pdf
A-CCS 068-Z-T
Hersteller: Assmann WSW Components
Description: CONN SOCKET PLCC 68POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 963 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+3.36 EUR
19+ 2.93 EUR
38+ 2.8 EUR
57+ 2.74 EUR
114+ 2.62 EUR
266+ 2.37 EUR
513+ 2.18 EUR
Mindestbestellmenge: 6
AR 20-HZW/TN ASS_6290_CO.pdf
AR 20-HZW/TN
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
auf Bestellung 623 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+3.59 EUR
24+ 3.13 EUR
48+ 2.93 EUR
120+ 2.8 EUR
264+ 2.53 EUR
504+ 2.33 EUR
Mindestbestellmenge: 5
DSC1033AE1-005.0000 DSC1033%20Datasheet%20MKQBPD0318091-7.pdf
DSC1033AE1-005.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 5.0000MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1033AE1-005.0000T DSC1033%20Datasheet%20MKQBPD0318091-7.pdf
DSC1033AE1-005.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 5.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1122AE1-005.0000 DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254A.pdf
DSC1122AE1-005.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 5.0000MHZ LVPECL SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1122AE1-005.0000 DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254A.pdf
DSC1122AE1-005.0000
Hersteller: Microchip Technology
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5
Packaging: Tube
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1122AE1-005.0000 DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254A.pdf
DSC1122AE1-005.0000
Hersteller: Microchip Technology
Standard Clock Oscillators MEMS OSC, PECL, 5MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Produkt ist nicht verfügbar
DSC1122AE1-005.0000T DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254A.pdf
DSC1122AE1-005.0000T
Hersteller: Microchip Technology
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1122AE1-005.0000T DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254A.pdf
DSC1122AE1-005.0000T
Hersteller: Microchip Technology
Standard Clock Oscillators MEMS OSC, PECL, 5MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Produkt ist nicht verfügbar
SI5386A-E10051-GM si5386_datasheet-2507566.pdf
SI5386A-E10051-GM
Hersteller: Skyworks Solutions, Inc.
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Produkt ist nicht verfügbar
SI5386A-E10051-GMR si5386_datasheet-2507566.pdf
SI5386A-E10051-GMR
Hersteller: Skyworks Solutions, Inc.
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Produkt ist nicht verfügbar
A-CCS20-Z-R A-CCSxx-x-R_REV00_Dwg.pdf
A-CCS20-Z-R
Hersteller: Assmann WSW Components
Description: CONN SOCKET PLCC 20POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (4 x 5)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
A-CCS32-Z-R A-CCSxx-x-R_REV00_Dwg.pdf
A-CCS32-Z-R
Hersteller: Assmann WSW Components
Description: CONN SOCKET PLCC 32POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
A-CCS52-Z-R A-CCSxx-x-R_REV00_Dwg.pdf
A-CCS52-Z-R
Hersteller: Assmann WSW Components
Description: CONN SOCKET PLCC 52POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 52 (4 x 13)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
AK430-3
AK430-3
Hersteller: Assmann WSW Components
Description: CABLE CENTRONICS M-F 3M
Packaging: Bulk
Length: 9.84' (3.00m)
Shielding: Shielded
Style: Bidirectional
Configuration: Centronics 36 pos Female to Male
Cable Type: Round, Beige
Produkt ist nicht verfügbar
AR 24-HZW/TN ASS_3579_CO.pdf
AR 24-HZW/TN
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 28-HZW/TN ASS_3579_CO.pdf
AR 28-HZW/TN
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 40-HZW/TN ASS_3580_CO.pdf
AR 40-HZW/TN
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar