Suchergebnisse für "ae1005" : 20
Art der Ansicht :
Mindestbestellmenge: 8
Mindestbestellmenge: 7
Mindestbestellmenge: 6
Mindestbestellmenge: 5
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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A-CCS 028-Z-T | Assmann WSW Components |
Description: CONN SOCKET PLCC 28POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: PLCC Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 28 (4 x 7) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 160.0µin (4.06µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 160.0µin (4.06µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 136 Stücke: Lieferzeit 10-14 Tag (e) |
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A-CCS 044-Z-T | Assmann WSW Components |
Description: CONN SOCKET PLCC 44POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: PLCC Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 44 (4 x 11) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 160.0µin (4.06µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 160.0µin (4.06µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 3867 Stücke: Lieferzeit 10-14 Tag (e) |
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A-CCS 068-Z-T | Assmann WSW Components |
Description: CONN SOCKET PLCC 68POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: PLCC Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 68 (4 x 17) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 160.0µin (4.06µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 160.0µin (4.06µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 963 Stücke: Lieferzeit 10-14 Tag (e) |
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AR 20-HZW/TN | Assmann WSW Components |
Description: CONN IC DIP SOCKET 20POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
auf Bestellung 623 Stücke: Lieferzeit 10-14 Tag (e) |
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DSC1033AE1-005.0000 | Microchip Technology |
Description: MEMS OSC XO 5.0000MHZ CMOS SMD Packaging: Tube Package / Case: 4-SMD, No Lead Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 3.3V Current - Supply (Max): 3mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 5 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1033AE1-005.0000T | Microchip Technology |
Description: MEMS OSC XO 5.0000MHZ CMOS SMD Packaging: Tape & Reel (TR) Package / Case: 4-SMD, No Lead Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 3.3V Current - Supply (Max): 3mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 5 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1122AE1-005.0000 | Microchip Technology |
Description: MEMS OSC XO 5.0000MHZ LVPECL SMD Packaging: Strip Package / Case: 6-VDFN Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 58mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 5 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1122AE1-005.0000 | Microchip Technology |
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5 Packaging: Tube Package / Case: 6-VDFN Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Voltage - Supply: 2.25V ~ 3.6V Current - Supply (Max): 58mA Height - Seated (Max): 0.035" (0.90mm) Absolute Pull Range (APR): ±50ppm Frequency: 5 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1122AE1-005.0000 | Microchip Technology | Standard Clock Oscillators MEMS OSC, PECL, 5MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm |
Produkt ist nicht verfügbar |
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DSC1122AE1-005.0000T | Microchip Technology |
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5 Packaging: Strip Package / Case: 6-VDFN Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Current - Supply (Max): 58mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 5 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1122AE1-005.0000T | Microchip Technology | Standard Clock Oscillators MEMS OSC, PECL, 5MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm |
Produkt ist nicht verfügbar |
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SI5386A-E10051-GM | Skyworks Solutions, Inc. | Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier |
Produkt ist nicht verfügbar |
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SI5386A-E10051-GMR | Skyworks Solutions, Inc. | Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier |
Produkt ist nicht verfügbar |
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A-CCS20-Z-R | Assmann WSW Components |
Description: CONN SOCKET PLCC 20POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: PLCC Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 20 (4 x 5) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150.0µin (3.81µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150.0µin (3.81µm) Contact Material - Post: Phosphor Bronze |
Produkt ist nicht verfügbar |
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A-CCS32-Z-R | Assmann WSW Components |
Description: CONN SOCKET PLCC 32POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: PLCC Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150.0µin (3.81µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150.0µin (3.81µm) Contact Material - Post: Phosphor Bronze |
Produkt ist nicht verfügbar |
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A-CCS52-Z-R | Assmann WSW Components |
Description: CONN SOCKET PLCC 52POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: PLCC Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 52 (4 x 13) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150.0µin (3.81µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150.0µin (3.81µm) Contact Material - Post: Phosphor Bronze |
Produkt ist nicht verfügbar |
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AK430-3 | Assmann WSW Components |
Description: CABLE CENTRONICS M-F 3M Packaging: Bulk Length: 9.84' (3.00m) Shielding: Shielded Style: Bidirectional Configuration: Centronics 36 pos Female to Male Cable Type: Round, Beige |
Produkt ist nicht verfügbar |
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AR 24-HZW/TN | Assmann WSW Components |
Description: CONN IC DIP SOCKET 24POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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AR 28-HZW/TN | Assmann WSW Components |
Description: CONN IC DIP SOCKET 28POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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AR 40-HZW/TN | Assmann WSW Components |
Description: CONN IC DIP SOCKET 40POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
A-CCS 028-Z-T |
Hersteller: Assmann WSW Components
Description: CONN SOCKET PLCC 28POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (4 x 7)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET PLCC 28POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (4 x 7)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 136 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 2.31 EUR |
10+ | 1.95 EUR |
33+ | 1.87 EUR |
66+ | 1.83 EUR |
132+ | 1.75 EUR |
A-CCS 044-Z-T |
Hersteller: Assmann WSW Components
Description: CONN SOCKET PLCC 44POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 44 (4 x 11)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET PLCC 44POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 44 (4 x 11)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 3867 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 2.6 EUR |
10+ | 2.25 EUR |
25+ | 2.16 EUR |
50+ | 2.11 EUR |
100+ | 2.02 EUR |
250+ | 1.82 EUR |
500+ | 1.68 EUR |
1000+ | 1.44 EUR |
2500+ | 1.34 EUR |
A-CCS 068-Z-T |
Hersteller: Assmann WSW Components
Description: CONN SOCKET PLCC 68POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET PLCC 68POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 963 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 3.36 EUR |
19+ | 2.93 EUR |
38+ | 2.8 EUR |
57+ | 2.74 EUR |
114+ | 2.62 EUR |
266+ | 2.37 EUR |
513+ | 2.18 EUR |
AR 20-HZW/TN |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
auf Bestellung 623 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 3.59 EUR |
24+ | 3.13 EUR |
48+ | 2.93 EUR |
120+ | 2.8 EUR |
264+ | 2.53 EUR |
504+ | 2.33 EUR |
DSC1033AE1-005.0000 |
Hersteller: Microchip Technology
Description: MEMS OSC XO 5.0000MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 5.0000MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1033AE1-005.0000T |
Hersteller: Microchip Technology
Description: MEMS OSC XO 5.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 5.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1122AE1-005.0000 |
Hersteller: Microchip Technology
Description: MEMS OSC XO 5.0000MHZ LVPECL SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 5.0000MHZ LVPECL SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1122AE1-005.0000 |
Hersteller: Microchip Technology
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5
Packaging: Tube
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 5 MHz
Base Resonator: MEMS
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5
Packaging: Tube
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1122AE1-005.0000 |
Hersteller: Microchip Technology
Standard Clock Oscillators MEMS OSC, PECL, 5MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Standard Clock Oscillators MEMS OSC, PECL, 5MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Produkt ist nicht verfügbar
DSC1122AE1-005.0000T |
Hersteller: Microchip Technology
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1122AE1-005.0000T |
Hersteller: Microchip Technology
Standard Clock Oscillators MEMS OSC, PECL, 5MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Standard Clock Oscillators MEMS OSC, PECL, 5MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Produkt ist nicht verfügbar
SI5386A-E10051-GM |
Hersteller: Skyworks Solutions, Inc.
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Produkt ist nicht verfügbar
SI5386A-E10051-GMR |
Hersteller: Skyworks Solutions, Inc.
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Produkt ist nicht verfügbar
A-CCS20-Z-R |
Hersteller: Assmann WSW Components
Description: CONN SOCKET PLCC 20POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (4 x 5)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET PLCC 20POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (4 x 5)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
A-CCS32-Z-R |
Hersteller: Assmann WSW Components
Description: CONN SOCKET PLCC 32POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET PLCC 32POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
A-CCS52-Z-R |
Hersteller: Assmann WSW Components
Description: CONN SOCKET PLCC 52POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 52 (4 x 13)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET PLCC 52POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 52 (4 x 13)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
AK430-3 |
Hersteller: Assmann WSW Components
Description: CABLE CENTRONICS M-F 3M
Packaging: Bulk
Length: 9.84' (3.00m)
Shielding: Shielded
Style: Bidirectional
Configuration: Centronics 36 pos Female to Male
Cable Type: Round, Beige
Description: CABLE CENTRONICS M-F 3M
Packaging: Bulk
Length: 9.84' (3.00m)
Shielding: Shielded
Style: Bidirectional
Configuration: Centronics 36 pos Female to Male
Cable Type: Round, Beige
Produkt ist nicht verfügbar
AR 24-HZW/TN |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 28-HZW/TN |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 40-HZW/TN |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar