BDN14-3CB/A01 CTS Thermal Management Products
Hersteller: CTS Thermal Management ProductsDescription: HEATSINK CPU W/ADHESIVE 1.41"SQ
Packaging: Box
Material: Aluminum
Length: 1.410" (35.81mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.410" (35.81mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.60°C/W @ 400 LFM
Thermal Resistance @ Natural: 16.20°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 564 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.83 EUR |
| 10+ | 5.67 EUR |
| 25+ | 5.52 EUR |
| 50+ | 5.21 EUR |
| 100+ | 4.9 EUR |
| 250+ | 4.6 EUR |
| 500+ | 4.44 EUR |
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Technische Details BDN14-3CB/A01 CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.41"SQ, Packaging: Box, Material: Aluminum, Length: 1.410" (35.81mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.410" (35.81mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 5.60°C/W @ 400 LFM, Thermal Resistance @ Natural: 16.20°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote BDN14-3CB/A01
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| BDN143CBA01 | Hersteller : CTS Electronic Components |
Heat Sinks IERC Heat Sink 1.41x1.41x0.355 |
auf Bestellung 57 Stücke: Lieferzeit 10-14 Tag (e) |