BDN186CBA01 CTS Electronic Components
auf Bestellung 3782 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 11.09 EUR |
| 10+ | 10.47 EUR |
| 50+ | 10.16 EUR |
| 100+ | 9.7 EUR |
| 500+ | 9.24 EUR |
| 1000+ | 8.4 EUR |
| 2000+ | 8.11 EUR |
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Technische Details BDN186CBA01 CTS Electronic Components
Description: HEATSINK CPU W/ADHESIVE 1.81"SQ, Packaging: Box, Material: Aluminum, Length: 1.810" (45.97mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.810" (45.97mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 400 LFM, Thermal Resistance @ Natural: 8.10°C/W, Fin Height: 0.605" (15.37mm), Material Finish: Black Anodized.
Weitere Produktangebote BDN186CBA01 nach Preis ab 6.6 EUR bis 9.59 EUR
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| BDN18-6CB/A01 | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK CPU W/ADHESIVE 1.81"SQPackaging: Box Material: Aluminum Length: 1.810" (45.97mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.810" (45.97mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 400 LFM Thermal Resistance @ Natural: 8.10°C/W Fin Height: 0.605" (15.37mm) Material Finish: Black Anodized |
auf Bestellung 1796 Stücke: Lieferzeit 10-14 Tag (e) |
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