DC0021/01-TI900-0.12-0 t-Global Technology
Hersteller: t-Global TechnologyDescription: THERM PAD 104.1MMX73.7MM WHT
Packaging: Box
Color: White
Material: Silicone
Shape: Rectangular
Thickness: 0.0050" (0.127mm)
Type: Die-Cut Pad, Sheet
Usage: Power Module
Outline: 104.10mm x 73.70mm
Thermal Conductivity: 1.8W/m-K
Backing, Carrier: Viscose
Part Status: Active
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details DC0021/01-TI900-0.12-0 t-Global Technology
Description: THERM PAD 104.1MMX73.7MM WHT, Packaging: Box, Color: White, Material: Silicone, Shape: Rectangular, Thickness: 0.0050" (0.127mm), Type: Die-Cut Pad, Sheet, Usage: Power Module, Outline: 104.10mm x 73.70mm, Thermal Conductivity: 1.8W/m-K, Backing, Carrier: Viscose, Part Status: Active.