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DIP600T300P12

DIP600T300P12 Chip Quik Inc.


DIP600T300P12.pdf Hersteller: Chip Quik Inc.
Description: DIP-12 (0.6" BODY) TO DIP-12 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
auf Bestellung 40 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+4.01 EUR
Mindestbestellmenge: 5
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Technische Details DIP600T300P12 Chip Quik Inc.

Description: DIP-12 (0.6" BODY) TO DIP-12 (0., Packaging: Bulk, Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm), Material: FR4 Epoxy Glass, Number of Positions: 12, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: DIP to DIP, Part Status: Active.