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FEMC032G-M10 Flexxon Pte Ltd

Flexxon-Product-overview-November-%2021-%202022-Final.pdf

Hersteller: Flexxon Pte Ltd
Description: IC FLSH 256GBIT EMMC 5.1 153FBGA
Packaging: Tray
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 256Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (TLC)
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-FBGA (11.5x13)
Memory Interface: eMMC_5.1
Memory Organization: 32G x 8
DigiKey Programmable: Not Verified

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Technische Details FEMC032G-M10 Flexxon Pte Ltd

Description: IC FLSH 256GBIT EMMC 5.1 153FBGA, Packaging: Tray, Package / Case: 153-VFBGA, Mounting Type: Surface Mount, Memory Size: 256Gbit, Memory Type: Non-Volatile, Operating Temperature: -25°C ~ 85°C, Voltage - Supply: 2.7V ~ 3.6V, Technology: FLASH - NAND (TLC), Clock Frequency: 200 MHz, Memory Format: FLASH, Supplier Device Package: 153-FBGA (11.5x13), Memory Interface: eMMC_5.1, Memory Organization: 32G x 8, DigiKey Programmable: Not Verified.