FI-XPB30SL-HF10 JAE Electronics

Description: CONN RCPT 30P 0.039 GOLD SMD R/A, Features: Grounding Pins, Shielded, Solder Retention, Packaging: Bulk, Connector Type: Receptacle, Mounting Type: Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle, Number of Positions: 30, Style: Board to Cable/Wire, Contact Type: Non-Gendered, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Beige, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 12.0µin (0.30µm), Contact Finish - Post: Tin, Number of Rows: 1.