Produkte > JAE ELECTRONICS > FI-XPB30SRL-HF11-R3000

FI-XPB30SRL-HF11-R3000 JAE Electronics


Hersteller: JAE Electronics
Description: CONN RCPT 30P 0.039 GOLD SMD R/A
Packaging: Tape & Reel (TR)
Features: Grounding Pins, Shielded, Solder Retention
Connector Type: Receptacle
Mounting Type: Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle, Reverse Mount
Number of Positions: 30
Style: Board to Cable/Wire
Contact Type: Non-Gendered
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Post: Tin
Number of Rows: 1
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Technische Details FI-XPB30SRL-HF11-R3000 JAE Electronics

Description: CONN RCPT 30P 0.039 GOLD SMD R/A, Packaging: Tape & Reel (TR), Features: Grounding Pins, Shielded, Solder Retention, Connector Type: Receptacle, Mounting Type: Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle, Reverse Mount, Number of Positions: 30, Style: Board to Cable/Wire, Contact Type: Non-Gendered, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 12.0µin (0.30µm), Contact Finish - Post: Tin, Number of Rows: 1.