FNB33060T6S onsemi
Hersteller: onsemi
Description: IC
Packaging: Bulk
Package / Case: 27-PowerDIP Module (1.205", 30.60mm)
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2500Vrms
Part Status: Active
Current: 30 A
Voltage: 600 V
Description: IC
Packaging: Bulk
Package / Case: 27-PowerDIP Module (1.205", 30.60mm)
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2500Vrms
Part Status: Active
Current: 30 A
Voltage: 600 V
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Technische Details FNB33060T6S onsemi
Description: IC, Packaging: Bulk, Package / Case: 27-PowerDIP Module (1.205", 30.60mm), Mounting Type: Through Hole, Type: IGBT, Configuration: 3 Phase Inverter, Voltage - Isolation: 2500Vrms, Part Status: Active, Current: 30 A, Voltage: 600 V.