FPC100P010-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.774" L x 0.157" W (19.65mm x 4.00mm)
Number of Positions: 10
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.774" L x 0.157" W (19.65mm x 4.00mm)
Number of Positions: 10
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Technische Details FPC100P010-S Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.039" (1.00mm), Type: FPC/FFC, Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Part Status: Active, Thermal Center Pad: 0.774" L x 0.157" W (19.65mm x 4.00mm), Number of Positions: 10.