IRAM336-025SB3 Infineon Technologies
Hersteller: Infineon TechnologiesDescription: IC HYBRID MULTI-CHIP 500V 2A
Packaging: Tube
Package / Case: 19-PowerSSIP Module, Formed Leads
Mounting Type: Through Hole
Type: MOSFET
Configuration: 3 Phase
Current: 2 A
Voltage: 500 V
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Technische Details IRAM336-025SB3 Infineon Technologies
Description: IC HYBRID MULTI-CHIP 500V 2A, Packaging: Tube, Package / Case: 19-PowerSSIP Module, Formed Leads, Mounting Type: Through Hole, Type: MOSFET, Configuration: 3 Phase, Current: 2 A, Voltage: 500 V.