NC2SW.031 1LB Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 62.99 EUR |
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Technische Details NC2SW.031 1LB Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL, Packaging: Bulk, Diameter: 0.031" (0.79mm), Wire Gauge: 20 AWG, 21 SWG, Composition: Sn60Pb40 (60/40), Type: Wire Solder, Melting Point: 361 ~ 370°F (183 ~ 188°C), Form: Spool, 1 lb (454 g), Process: Leaded, Flux Type: No-Clean, Part Status: Active.