PCB3001-1 Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: SOIC28W/N AND SOP28 TO DIP SMT A
Packaging: Bulk
Size / Dimension: 0.800" x 1.400" (20.32mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP
Part Status: Active
auf Bestellung 183 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.19 EUR |
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Technische Details PCB3001-1 Chip Quik Inc.
Description: SOIC28W/N AND SOP28 TO DIP SMT A, Packaging: Bulk, Size / Dimension: 0.800" x 1.400" (20.32mm x 35.56mm), Material: FR4 Epoxy Glass, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: SOIC, SOP, Part Status: Active.