QFS-016-04.25-H-D-DP-A-P-TR Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY RCP 32P SMD GOLD
Features: Board Guide, Ground Bus (Plane), Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Height Above Board: 0.278" (7.06mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 10mm, 11mm, 14mm
Number of Rows: 2
Description: CONN DIFF ARRAY RCP 32P SMD GOLD
Features: Board Guide, Ground Bus (Plane), Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Height Above Board: 0.278" (7.06mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 10mm, 11mm, 14mm
Number of Rows: 2
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Technische Details QFS-016-04.25-H-D-DP-A-P-TR Samtec Inc.
Description: CONN DIFF ARRAY RCP 32P SMD GOLD, Features: Board Guide, Ground Bus (Plane), Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 32, Pitch: 0.025" (0.64mm), Height Above Board: 0.278" (7.06mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 10mm, 11mm, 14mm, Number of Rows: 2.