R8A774C0HA01BG#GA Renesas Electronics Corporation
Hersteller: Renesas Electronics CorporationDescription: IC MPU RZ/G2E 1.2GHZ 552FPBGA
Packaging: Tray
Package / Case: 552-BGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 552-FPBGA
Ethernet: 10/100Mbps (1), 100/1000Mbps (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L
Graphics Acceleration: No
Display & Interface Controllers: MIPI-CSI
Additional Interfaces: CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 58.85 EUR |
| 10+ | 54.91 EUR |
| 25+ | 52.6 EUR |
| 80+ | 47.67 EUR |
| 300+ | 46.03 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details R8A774C0HA01BG#GA Renesas Electronics Corporation
Description: IC MPU RZ/G2E 1.2GHZ 552FPBGA, Packaging: Tray, Package / Case: 552-BGA, Mounting Type: Surface Mount, Speed: 1.2GHz, Operating Temperature: -40°C ~ 85°C (TA), Core Processor: ARM® Cortex®-A53, Supplier Device Package: 552-FPBGA, Ethernet: 10/100Mbps (1), 100/1000Mbps (1), USB: USB 2.0 (1), USB 3.0 (1), Number of Cores/Bus Width: 2 Core, 64-Bit, Co-Processors/DSP: Multimedia; NEON™ MPE, RAM Controllers: DDR3L, Graphics Acceleration: No, Display & Interface Controllers: MIPI-CSI, Additional Interfaces: CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI.