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SFM-105-T2-L-D-SN-P

SFM-105-T2-L-D-SN-P Samtec Inc.


sfm.pdf Hersteller: Samtec Inc.
Description: CONN RCPT 10POS 0.05 GOLD SMD
Packaging: Bulk
Features: Pick and Place, Solder Retention
Connector Type: Receptacle
Voltage Rating: 250VAC
Current Rating (Amps): 3.2A per Contact
Mounting Type: Surface Mount
Number of Positions: 10
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Mated Stacking Heights: 6.15mm, 6.30mm, 7.92mm, 8.08mm, 9.70mm, 9.86mm, 11.61mm, 11.76mm
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.185" (4.70mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
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Technische Details SFM-105-T2-L-D-SN-P Samtec Inc.

Description: CONN RCPT 10POS 0.05 GOLD SMD, Packaging: Bulk, Features: Pick and Place, Solder Retention, Connector Type: Receptacle, Voltage Rating: 250VAC, Current Rating (Amps): 3.2A per Contact, Mounting Type: Surface Mount, Number of Positions: 10, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Mated Stacking Heights: 6.15mm, 6.30mm, 7.92mm, 8.08mm, 9.70mm, 9.86mm, 11.61mm, 11.76mm, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Insulation Height: 0.185" (4.70mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.