WBNCSAC32

WBNCSAC32 SRA Soldering Products


tds-wbncsac.pdf Hersteller: SRA Soldering Products
Description: LEAD FREE NO-CLEAN FLUX CORE SIL
Packaging: Spool
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 430°F (221°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
auf Bestellung 9 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+158.19 EUR
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Technische Details WBNCSAC32 SRA Soldering Products

Description: LEAD FREE NO-CLEAN FLUX CORE SIL, Packaging: Spool, Diameter: 0.032" (0.81mm), Wire Gauge: 20 AWG, 21 SWG, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Wire Solder, Melting Point: 430°F (221°C), Form: Spool, 1 lb (454 g), Process: Lead Free, Flux Type: No-Clean.