WCI2012CPR10JDG

WCI2012CPR10JDG INPAQ Technology Co., Ltd


WCI2012CP Series.pdf Hersteller: INPAQ Technology Co., Ltd
Description: CHIP IND 2012,100NH,J,65Q,0.4A,3
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: 0805 (2012 Metric)
Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -25°C ~ 125°C
DC Resistance (DCR): 460mOhm Max
Q @ Freq: 65 @ 500MHz
Frequency - Self Resonant: 1.2GHz
Material - Core: Ceramic
Inductance Frequency - Test: 150 MHz
Supplier Device Package: 0805
Height - Seated (Max): 0.060" (1.52mm)
Inductance: 100 nH
Current Rating (Amps): 400 mA
auf Bestellung 15000 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
84+0.21 EUR
100+ 0.18 EUR
110+ 0.16 EUR
124+ 0.14 EUR
142+ 0.12 EUR
500+ 0.11 EUR
1000+ 0.085 EUR
Mindestbestellmenge: 84
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Technische Details WCI2012CPR10JDG INPAQ Technology Co., Ltd

Description: CHIP IND 2012,100NH,J,65Q,0.4A,3, Packaging: Cut Tape (CT), Tolerance: ±5%, Package / Case: 0805 (2012 Metric), Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Wirewound, Operating Temperature: -25°C ~ 125°C, DC Resistance (DCR): 460mOhm Max, Q @ Freq: 65 @ 500MHz, Frequency - Self Resonant: 1.2GHz, Material - Core: Ceramic, Inductance Frequency - Test: 150 MHz, Supplier Device Package: 0805, Height - Seated (Max): 0.060" (1.52mm), Inductance: 100 nH, Current Rating (Amps): 400 mA.