auf Bestellung 400 Stücke:
Lieferzeit 182-186 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 3.77 EUR |
| 10+ | 3.08 EUR |
| 100+ | 2.94 EUR |
| 250+ | 2.66 EUR |
| 400+ | 2.43 EUR |
| 1200+ | 2.08 EUR |
| 2800+ | 1.95 EUR |
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Technische Details XR2C-1011-N Omron Electronics
Description: CONN SOCKET SIP 10POS GOLD, Packaging: Bulk, Mounting Type: Threaded, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (1 x 10), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote XR2C-1011-N nach Preis ab 2.67 EUR bis 3.78 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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XR2C1011N | Hersteller : Omron Electronics Inc-EMC Div |
 Description: CONN SOCKET SIP 10POS GOLDPackaging: Bulk Mounting Type: Threaded Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 410 Stücke: Lieferzeit 10-14 Tag (e) |
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