Produkte > AMPHENOL ICC (FCI) > Alle Produkte des Herstellers AMPHENOL ICC (FCI) (47522) > Seite 705 nach 793
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F33X-1AAJ1-E8951 | Amphenol ICC (FCI) |
![]() Features: Board Guide, Zero Insertion Force (ZIF) Packaging: Tape & Reel (TR) Contact Finish: Gold Voltage Rating: 50V Mounting Type: Surface Mount, Right Angle Number of Positions: 51 Pitch: 0.020" (0.50mm) Operating Temperature: -55°C ~ 85°C Termination: Solder Height Above Board: 0.083" (2.10mm) Locking Feature: Flip Lock Material Flammability Rating: UL94 V-0 Actuator Material: Liquid Crystal Polymer (LCP), Glass Filled Contact Material: Phosphor Bronze FFC, FCB Thickness: 0.30mm Housing Material: Liquid Crystal Polymer (LCP), Glass Filled Cable End Type: Notched, Tapered Flat Flex Type: FFC, FPC Connector/Contact Type: Contacts, Bottom |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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F33X-1AAJ1-E8951 | Amphenol ICC (FCI) |
![]() Features: Board Guide, Zero Insertion Force (ZIF) Packaging: Cut Tape (CT) Contact Finish: Gold Voltage Rating: 50V Mounting Type: Surface Mount, Right Angle Number of Positions: 51 Pitch: 0.020" (0.50mm) Operating Temperature: -55°C ~ 85°C Termination: Solder Height Above Board: 0.083" (2.10mm) Locking Feature: Flip Lock Material Flammability Rating: UL94 V-0 Actuator Material: Liquid Crystal Polymer (LCP), Glass Filled Contact Material: Phosphor Bronze FFC, FCB Thickness: 0.30mm Housing Material: Liquid Crystal Polymer (LCP), Glass Filled Cable End Type: Notched, Tapered Flat Flex Type: FFC, FPC Connector/Contact Type: Contacts, Bottom |
auf Bestellung 9938 Stücke: Lieferzeit 10-14 Tag (e) |
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69190-517 | Amphenol ICC (FCI) |
![]() Packaging: Bulk Connector Type: Header Mounting Type: Through Hole Number of Positions: 17 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Press-Fit, Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold or Gold, GXT™ Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Shape: Square Contact Length - Post: 0.120" (3.05mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 0.450" (11.43mm) Contact Length - Mating: 0.230" (5.84mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
68779-404HLF | Amphenol ICC (FCI) |
Description: BERGSTIK II .100CC DR ST RAIGHT Packaging: Bag Connector Type: Header Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 4 Number of Rows: 2 Style: Board to Board Operating Temperature: -65°C ~ 130°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Post: Tin Contact Shape: Square Contact Length - Post: 0.318" (8.08mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 0.736" (18.69mm) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.318" (8.08mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
68459-404HLF | Amphenol ICC (FCI) |
Description: BERGSTIK II .100CC DR ST RAIGHT Packaging: Bulk Connector Type: Header Voltage Rating: 110V Current Rating (Amps): 5A Mounting Type: Through Hole, Right Angle Number of Positions: 4 Number of Rows: 2 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Post: Tin Contact Shape: Square Contact Length - Post: 0.150" (3.81mm) Insulation Height: 0.190" (4.83mm) Shrouding: Unshrouded Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.318" (8.08mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X02-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 2 (1 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X02-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 2 (1 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X03-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 3 (1 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X03-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 3 (1 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X04-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 4 (1 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X04-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 4 (1 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X05-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 5 (1 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X06-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 6 (1 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X05-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 5 (1 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X07-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 7 (1 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X06-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 6 (1 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X08-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 8 (1 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X07-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 7 (1 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X09-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 9 (1 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X08-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 8 (1 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X10-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X09-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 9 (1 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X11-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 11 (1 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X12-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X10-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X11-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 11 (1 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X13-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 13 (1 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X14-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 14 (1 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X12-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X15-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 15 (1 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X13-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 13 (1 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X16-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 16 (1 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X14-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 14 (1 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X15-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 15 (1 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X20-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X18-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 18 (1 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X16-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 16 (1 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X19-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 19 (1 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X21-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 21 (1 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X18-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 18 (1 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X22-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 22 (1 x 22) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X19-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 19 (1 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X20-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X23-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 23 (1 x 23) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X24-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 24 (1 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X25-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 25 (1 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X21-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 21 (1 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X22-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 22 (1 x 22) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X26-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 26 (1 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X23-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 23 (1 x 23) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X28-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 28 (1 x 28) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X24-160B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 24 (1 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SIP050-1X29-157B | Amphenol ICC (FCI) |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 29 (1 x 29) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
68032-136H | Amphenol ICC (FCI) |
![]() Packaging: Bulk Connector Type: Header Mounting Type: Through Hole Number of Positions: 36 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold or Gold, GXT™ Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Shape: Square Contact Length - Post: 0.213" (5.40mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 0.543" (13.80mm) Contact Length - Mating: 0.230" (5.84mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
68032-136 | Amphenol ICC (FCI) |
![]() Packaging: Bulk Connector Type: Header Mounting Type: Through Hole Number of Positions: 36 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold or Gold, GXT™ Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Shape: Square Contact Length - Post: 0.213" (5.40mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 0.543" (13.80mm) Contact Length - Mating: 0.230" (5.84mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
86093967113785000E1 | Amphenol ICC (FCI) |
![]() Packaging: Bag Connector Type: Header, Male Pins Contact Finish: Gold Mounting Type: Through Hole, Right Angle Number of Positions: 96 Pitch: 0.100" (2.54mm) Style: C Number of Positions Loaded: All Termination: Solder Number of Rows: 3 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
87549-4111 | Amphenol ICC (FCI) |
![]() Packaging: Tape & Reel (TR) Features: Board Guide, Keyed, Panel Stops, Solder Retention Connector Type: Jack Contact Finish: Gold Mounting Type: Surface Mount Shielding: Unshielded Orientation: Vertical Number of Positions/Contacts: 8p8c (RJ45, Ethernet) Termination: Solder LED Color: Does Not Contain LED Ratings: Cat3 Tab Direction: User Selectable Contact Material: Phosphor Bronze Number of Ports: 1 Number of Rows: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
70236-302 | Amphenol ICC (FCI) |
![]() Packaging: Tube Connector Type: Header, Male Blades Contact Finish: Gold Color: Natural Mounting Type: Through Hole Number of Positions: 8 Pitch: 0.236" (6.00mm) Number of Rows: 4 Number of Positions Loaded: All Termination: Press-Fit Connector Style: Blade Power Contact Finish Thickness: 30.0µin (0.76µm) Contact Layout, Typical: 8 Power |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
54121-810021500LF | Amphenol ICC (FCI) |
Description: CONN HDR STACK Packaging: Bag Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold, GXT™ Contact Finish Thickness - Post (Mating): 15.0µin (0.38µm) Number of Rows: 1 Number of Positions: 2 Length - Overall Pin: 1.125" (28.575mm) Length - Post (Mating): 0.415" (10.541mm) Length - Stack Height: 0.591" (15.000mm) Length - Tail: 0.120" (3.050mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
861400161YO6LF | Amphenol ICC (FCI) |
Description: BERGSTIK STR Packaging: Bulk Connector Type: Header, Breakaway Voltage Rating: 1000V Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 16 Number of Rows: 1 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold or Gold, GXT™ Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Shape: Square Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.102" (2.60mm) Shrouding: Unshrouded Overall Contact Length: 0.496" (12.60mm) Insulation Material: Thermoplastic Contact Length - Mating: 0.276" (7.00mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
F33X-1AAJ1-E8951 |
![]() |
Hersteller: Amphenol ICC (FCI)
Description: FLEX CONNECTOR, P=0.50MM, H=2.1M
Features: Board Guide, Zero Insertion Force (ZIF)
Packaging: Tape & Reel (TR)
Contact Finish: Gold
Voltage Rating: 50V
Mounting Type: Surface Mount, Right Angle
Number of Positions: 51
Pitch: 0.020" (0.50mm)
Operating Temperature: -55°C ~ 85°C
Termination: Solder
Height Above Board: 0.083" (2.10mm)
Locking Feature: Flip Lock
Material Flammability Rating: UL94 V-0
Actuator Material: Liquid Crystal Polymer (LCP), Glass Filled
Contact Material: Phosphor Bronze
FFC, FCB Thickness: 0.30mm
Housing Material: Liquid Crystal Polymer (LCP), Glass Filled
Cable End Type: Notched, Tapered
Flat Flex Type: FFC, FPC
Connector/Contact Type: Contacts, Bottom
Description: FLEX CONNECTOR, P=0.50MM, H=2.1M
Features: Board Guide, Zero Insertion Force (ZIF)
Packaging: Tape & Reel (TR)
Contact Finish: Gold
Voltage Rating: 50V
Mounting Type: Surface Mount, Right Angle
Number of Positions: 51
Pitch: 0.020" (0.50mm)
Operating Temperature: -55°C ~ 85°C
Termination: Solder
Height Above Board: 0.083" (2.10mm)
Locking Feature: Flip Lock
Material Flammability Rating: UL94 V-0
Actuator Material: Liquid Crystal Polymer (LCP), Glass Filled
Contact Material: Phosphor Bronze
FFC, FCB Thickness: 0.30mm
Housing Material: Liquid Crystal Polymer (LCP), Glass Filled
Cable End Type: Notched, Tapered
Flat Flex Type: FFC, FPC
Connector/Contact Type: Contacts, Bottom
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2000+ | 0.82 EUR |
4000+ | 0.80 EUR |
6000+ | 0.77 EUR |
F33X-1AAJ1-E8951 |
![]() |
Hersteller: Amphenol ICC (FCI)
Description: FLEX CONNECTOR, P=0.50MM, H=2.1M
Features: Board Guide, Zero Insertion Force (ZIF)
Packaging: Cut Tape (CT)
Contact Finish: Gold
Voltage Rating: 50V
Mounting Type: Surface Mount, Right Angle
Number of Positions: 51
Pitch: 0.020" (0.50mm)
Operating Temperature: -55°C ~ 85°C
Termination: Solder
Height Above Board: 0.083" (2.10mm)
Locking Feature: Flip Lock
Material Flammability Rating: UL94 V-0
Actuator Material: Liquid Crystal Polymer (LCP), Glass Filled
Contact Material: Phosphor Bronze
FFC, FCB Thickness: 0.30mm
Housing Material: Liquid Crystal Polymer (LCP), Glass Filled
Cable End Type: Notched, Tapered
Flat Flex Type: FFC, FPC
Connector/Contact Type: Contacts, Bottom
Description: FLEX CONNECTOR, P=0.50MM, H=2.1M
Features: Board Guide, Zero Insertion Force (ZIF)
Packaging: Cut Tape (CT)
Contact Finish: Gold
Voltage Rating: 50V
Mounting Type: Surface Mount, Right Angle
Number of Positions: 51
Pitch: 0.020" (0.50mm)
Operating Temperature: -55°C ~ 85°C
Termination: Solder
Height Above Board: 0.083" (2.10mm)
Locking Feature: Flip Lock
Material Flammability Rating: UL94 V-0
Actuator Material: Liquid Crystal Polymer (LCP), Glass Filled
Contact Material: Phosphor Bronze
FFC, FCB Thickness: 0.30mm
Housing Material: Liquid Crystal Polymer (LCP), Glass Filled
Cable End Type: Notched, Tapered
Flat Flex Type: FFC, FPC
Connector/Contact Type: Contacts, Bottom
auf Bestellung 9938 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
11+ | 1.60 EUR |
14+ | 1.35 EUR |
25+ | 1.29 EUR |
50+ | 1.26 EUR |
100+ | 1.21 EUR |
250+ | 1.10 EUR |
500+ | 0.99 EUR |
1000+ | 0.88 EUR |
69190-517 |
![]() |
Hersteller: Amphenol ICC (FCI)
Description: CONN HEADER VERT 17POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 17
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit, Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Shape: Square
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.450" (11.43mm)
Contact Length - Mating: 0.230" (5.84mm)
Description: CONN HEADER VERT 17POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 17
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit, Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Shape: Square
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.450" (11.43mm)
Contact Length - Mating: 0.230" (5.84mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
68779-404HLF |
Hersteller: Amphenol ICC (FCI)
Description: BERGSTIK II .100CC DR ST RAIGHT
Packaging: Bag
Connector Type: Header
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 4
Number of Rows: 2
Style: Board to Board
Operating Temperature: -65°C ~ 130°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.318" (8.08mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.736" (18.69mm)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
Description: BERGSTIK II .100CC DR ST RAIGHT
Packaging: Bag
Connector Type: Header
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 4
Number of Rows: 2
Style: Board to Board
Operating Temperature: -65°C ~ 130°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.318" (8.08mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.736" (18.69mm)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
68459-404HLF |
Hersteller: Amphenol ICC (FCI)
Description: BERGSTIK II .100CC DR ST RAIGHT
Packaging: Bulk
Connector Type: Header
Voltage Rating: 110V
Current Rating (Amps): 5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 4
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.150" (3.81mm)
Insulation Height: 0.190" (4.83mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
Description: BERGSTIK II .100CC DR ST RAIGHT
Packaging: Bulk
Connector Type: Header
Voltage Rating: 110V
Current Rating (Amps): 5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 4
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.150" (3.81mm)
Insulation Height: 0.190" (4.83mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X02-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X02-157B-SIP SOCKET 2 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X02-157B-SIP SOCKET 2 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X02-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X02-160B-SIP SOCKET 2 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X02-160B-SIP SOCKET 2 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X03-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X03-157B-SIP SOCKET 3 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X03-157B-SIP SOCKET 3 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X03-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X03-160B-SIP SOCKET 3 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X03-160B-SIP SOCKET 3 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X04-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X04-157B-SIP SOCKET 4 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X04-157B-SIP SOCKET 4 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X04-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X04-160B-SIP SOCKET 4 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X04-160B-SIP SOCKET 4 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X05-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X05-157B-SIP SOCKET 5 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X05-157B-SIP SOCKET 5 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X06-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X06-157B-SIP SOCKET 6 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X06-157B-SIP SOCKET 6 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X05-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X05-160B-SIP SOCKET 5 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X05-160B-SIP SOCKET 5 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X07-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X07-157B-SIP SOCKET 7 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X07-157B-SIP SOCKET 7 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X06-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X06-160B-SIP SOCKET 6 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X06-160B-SIP SOCKET 6 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X08-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X08-157B-SIP SOCKET 8 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X08-157B-SIP SOCKET 8 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X07-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X07-160B-SIP SOCKET 7 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X07-160B-SIP SOCKET 7 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X09-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X09-157B-SIP SOCKET 9 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X09-157B-SIP SOCKET 9 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X08-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X08-160B-SIP SOCKET 8 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X08-160B-SIP SOCKET 8 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X10-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X10-157B-SIP SOCKET 10 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X10-157B-SIP SOCKET 10 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X09-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X09-160B-SIP SOCKET 9 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X09-160B-SIP SOCKET 9 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X11-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X11-157B-SIP SOCKET 11 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X11-157B-SIP SOCKET 11 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X12-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X12-157B-SIP SOCKET 12 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X12-157B-SIP SOCKET 12 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X10-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X10-160B-SIP SOCKET 10 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X10-160B-SIP SOCKET 10 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X11-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X11-160B-SIP SOCKET 11 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X11-160B-SIP SOCKET 11 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X13-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X13-157B-SIP SOCKET 13 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X13-157B-SIP SOCKET 13 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X14-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X14-157B-SIP SOCKET 14 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X14-157B-SIP SOCKET 14 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X12-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X12-160B-SIP SOCKET 12 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X12-160B-SIP SOCKET 12 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X15-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X15-157B-SIP SOCKET 15 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X15-157B-SIP SOCKET 15 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X13-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X13-160B-SIP SOCKET 13 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X13-160B-SIP SOCKET 13 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X16-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X16-157B-SIP SOCKET 16 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X16-157B-SIP SOCKET 16 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X14-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X14-160B-SIP SOCKET 14 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X14-160B-SIP SOCKET 14 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X15-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X15-160B-SIP SOCKET 15 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X15-160B-SIP SOCKET 15 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X20-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X20-157B-SIP SOCKET 20 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X20-157B-SIP SOCKET 20 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X18-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X18-157B-SIP SOCKET 18 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 18 (1 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X18-157B-SIP SOCKET 18 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 18 (1 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X16-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X16-160B-SIP SOCKET 16 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X16-160B-SIP SOCKET 16 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X19-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X19-157B-SIP SOCKET 19 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X19-157B-SIP SOCKET 19 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X21-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X21-157B-SIP SOCKET 21 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 21 (1 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X21-157B-SIP SOCKET 21 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 21 (1 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X18-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X18-160B-SIP SOCKET 18 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 18 (1 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X18-160B-SIP SOCKET 18 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 18 (1 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X22-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X22-157B-SIP SOCKET 22 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 22 (1 x 22)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X22-157B-SIP SOCKET 22 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 22 (1 x 22)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X19-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X19-160B-SIP SOCKET 19 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X19-160B-SIP SOCKET 19 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X20-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X20-160B-SIP SOCKET 20 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X20-160B-SIP SOCKET 20 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X23-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X23-157B-SIP SOCKET 23 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 23 (1 x 23)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X23-157B-SIP SOCKET 23 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 23 (1 x 23)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X24-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X24-157B-SIP SOCKET 24 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X24-157B-SIP SOCKET 24 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X25-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X25-157B-SIP SOCKET 25 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X25-157B-SIP SOCKET 25 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X21-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X21-160B-SIP SOCKET 21 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 21 (1 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X21-160B-SIP SOCKET 21 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 21 (1 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X22-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X22-160B-SIP SOCKET 22 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 22 (1 x 22)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X22-160B-SIP SOCKET 22 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 22 (1 x 22)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X26-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X26-157B-SIP SOCKET 26 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 26 (1 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X26-157B-SIP SOCKET 26 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 26 (1 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X23-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X23-160B-SIP SOCKET 23 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 23 (1 x 23)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X23-160B-SIP SOCKET 23 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 23 (1 x 23)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X28-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X28-157B-SIP SOCKET 28 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 28 (1 x 28)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X28-157B-SIP SOCKET 28 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 28 (1 x 28)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SIP050-1X24-160B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X24-160B-SIP SOCKET 24 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X24-160B-SIP SOCKET 24 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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SIP050-1X29-157B |
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Hersteller: Amphenol ICC (FCI)
Description: 1X29-157B-SIP SOCKET 29 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 29 (1 x 29)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X29-157B-SIP SOCKET 29 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 29 (1 x 29)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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68032-136H |
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Hersteller: Amphenol ICC (FCI)
Description: CONN HEADER VERT 36POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 36
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Shape: Square
Contact Length - Post: 0.213" (5.40mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.543" (13.80mm)
Contact Length - Mating: 0.230" (5.84mm)
Description: CONN HEADER VERT 36POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 36
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Shape: Square
Contact Length - Post: 0.213" (5.40mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.543" (13.80mm)
Contact Length - Mating: 0.230" (5.84mm)
Produkt ist nicht verfügbar
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68032-136 |
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Hersteller: Amphenol ICC (FCI)
Description: CONN HEADER VERT 36POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 36
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Shape: Square
Contact Length - Post: 0.213" (5.40mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.543" (13.80mm)
Contact Length - Mating: 0.230" (5.84mm)
Description: CONN HEADER VERT 36POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 36
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Shape: Square
Contact Length - Post: 0.213" (5.40mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.543" (13.80mm)
Contact Length - Mating: 0.230" (5.84mm)
Produkt ist nicht verfügbar
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86093967113785000E1 |
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Hersteller: Amphenol ICC (FCI)
Description: DIN RA HEADER F
Packaging: Bag
Connector Type: Header, Male Pins
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 96
Pitch: 0.100" (2.54mm)
Style: C
Number of Positions Loaded: All
Termination: Solder
Number of Rows: 3
Description: DIN RA HEADER F
Packaging: Bag
Connector Type: Header, Male Pins
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 96
Pitch: 0.100" (2.54mm)
Style: C
Number of Positions Loaded: All
Termination: Solder
Number of Rows: 3
Produkt ist nicht verfügbar
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87549-4111 |
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Hersteller: Amphenol ICC (FCI)
Description: CONN MOD JACK 8P8C
Packaging: Tape & Reel (TR)
Features: Board Guide, Keyed, Panel Stops, Solder Retention
Connector Type: Jack
Contact Finish: Gold
Mounting Type: Surface Mount
Shielding: Unshielded
Orientation: Vertical
Number of Positions/Contacts: 8p8c (RJ45, Ethernet)
Termination: Solder
LED Color: Does Not Contain LED
Ratings: Cat3
Tab Direction: User Selectable
Contact Material: Phosphor Bronze
Number of Ports: 1
Number of Rows: 1
Description: CONN MOD JACK 8P8C
Packaging: Tape & Reel (TR)
Features: Board Guide, Keyed, Panel Stops, Solder Retention
Connector Type: Jack
Contact Finish: Gold
Mounting Type: Surface Mount
Shielding: Unshielded
Orientation: Vertical
Number of Positions/Contacts: 8p8c (RJ45, Ethernet)
Termination: Solder
LED Color: Does Not Contain LED
Ratings: Cat3
Tab Direction: User Selectable
Contact Material: Phosphor Bronze
Number of Ports: 1
Number of Rows: 1
Produkt ist nicht verfügbar
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70236-302 |
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Hersteller: Amphenol ICC (FCI)
Description: 302 METRAL PWR HDR 1MX4R PF
Packaging: Tube
Connector Type: Header, Male Blades
Contact Finish: Gold
Color: Natural
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.236" (6.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Style: Blade Power
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Layout, Typical: 8 Power
Description: 302 METRAL PWR HDR 1MX4R PF
Packaging: Tube
Connector Type: Header, Male Blades
Contact Finish: Gold
Color: Natural
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.236" (6.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Style: Blade Power
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Layout, Typical: 8 Power
Produkt ist nicht verfügbar
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54121-810021500LF |
Hersteller: Amphenol ICC (FCI)
Description: CONN HDR STACK
Packaging: Bag
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold, GXT™
Contact Finish Thickness - Post (Mating): 15.0µin (0.38µm)
Number of Rows: 1
Number of Positions: 2
Length - Overall Pin: 1.125" (28.575mm)
Length - Post (Mating): 0.415" (10.541mm)
Length - Stack Height: 0.591" (15.000mm)
Length - Tail: 0.120" (3.050mm)
Description: CONN HDR STACK
Packaging: Bag
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold, GXT™
Contact Finish Thickness - Post (Mating): 15.0µin (0.38µm)
Number of Rows: 1
Number of Positions: 2
Length - Overall Pin: 1.125" (28.575mm)
Length - Post (Mating): 0.415" (10.541mm)
Length - Stack Height: 0.591" (15.000mm)
Length - Tail: 0.120" (3.050mm)
Produkt ist nicht verfügbar
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861400161YO6LF |
Hersteller: Amphenol ICC (FCI)
Description: BERGSTIK STR
Packaging: Bulk
Connector Type: Header, Breakaway
Voltage Rating: 1000V
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 16
Number of Rows: 1
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Shape: Square
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.102" (2.60mm)
Shrouding: Unshrouded
Overall Contact Length: 0.496" (12.60mm)
Insulation Material: Thermoplastic
Contact Length - Mating: 0.276" (7.00mm)
Description: BERGSTIK STR
Packaging: Bulk
Connector Type: Header, Breakaway
Voltage Rating: 1000V
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 16
Number of Rows: 1
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Shape: Square
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.102" (2.60mm)
Shrouding: Unshrouded
Overall Contact Length: 0.496" (12.60mm)
Insulation Material: Thermoplastic
Contact Length - Mating: 0.276" (7.00mm)
Produkt ist nicht verfügbar
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