| Foto | Bezeichnung | Hersteller | Beschreibung |
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5CSEBA2U23I7N | Intel |
 Description: IC SOC CORTEX-A9 800MHZ 672UBGAPackaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 46 Stücke: Lieferzeit 10-14 Tag (e) |
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5CSEBA2U23I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U19C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U19C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U19C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U19C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U19C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U19I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 207 Stücke: Lieferzeit 10-14 Tag (e) |
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5CSEBA4U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U23C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U23C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 41 Stücke: Lieferzeit 10-14 Tag (e) |
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5CSEBA4U23I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA5U23I7 | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA2U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA2U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA2U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA2U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA2U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA4U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA4U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA4U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| EVB-ED8101P02QI | Intel |
Description: EVAL BOARD FOR ED8101 Packaging: Bulk Function: Digital Power Controller Type: Power Management Utilized IC / Part: ED8101, ET4040 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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EVB-ES1022SI | Intel |
Description: EVAL BOARD FOR ES1022 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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EVB-EY1501DI-ADJ | Intel |
Description: EVAL BAORD FOR EY1501 Packaging: Bulk Voltage - Output: 0.8V ~ 5V Voltage - Input: 2.2V ~ 6V Current - Output: 1A Regulator Type: Positive Adjustable Board Type: Fully Populated Utilized IC / Part: EY1501DI-ADJ Supplied Contents: Board(s) Channels per IC: 1 - Single |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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EVI-ED8100COMMIF | Intel |
Description: DONGLE FOR ED8100 SERIES Packaging: Bulk Accessory Type: Interface Board |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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ED8101P00QI | Intel |
Description: IC REG CTRLR BUCK I2C 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Output Type: PWM Signal Mounting Type: Surface Mount Function: Step-Down Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: Positive Frequency - Switching: 500kHz ~ 1MHz Topology: Buck Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V Supplier Device Package: 24-QFN (4x4) Control Features: Power Good Serial Interfaces: I²C Output Phases: 1 Duty Cycle (Max): 100% Clock Sync: No Number of Outputs: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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ER3110DI | Intel |
Description: IC REG BUCK ADJUSTABLE 1A 12DFN Packaging: Tape & Reel (TR) Package / Case: 12-VFDFN Exposed Pad Output Type: Adjustable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 1A Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Positive Frequency - Switching: 300kHz ~ 2MHz Voltage - Input (Max): 36V Topology: Buck Supplier Device Package: 12-DFN (4x3) Synchronous Rectifier: Yes Voltage - Output (Max): 34V Voltage - Input (Min): 3V Voltage - Output (Min/Fixed): 0.6V Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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ES1020QI | Intel | Description: IC CONTROLLER SEQUENCING 24QFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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ES1022SI | Intel |
Description: IC CONTROLLER HOT SWAP 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Voltage - Input: 3.3V ~ 24V Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.3V ~ 24V Applications: Power Supply Sequencer Supplier Device Package: 14-SOIC Current - Supply: 286 µA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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EY1501DI-ADJ | Intel |
Description: IC REG LINEAR POS ADJ 1A 10DFN Packaging: Tape & Reel (TR) Package / Case: 10-VFDFN Exposed Pad Output Type: Adjustable Mounting Type: Surface Mount Current - Output: 1A Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 5 mA Voltage - Input (Max): 6V Number of Regulators: 1 Supplier Device Package: 10-DFN (3x3) Voltage - Output (Max): 5V Voltage - Output (Min/Fixed): 0.8V Control Features: Enable, Power Good, Soft Start Part Status: Obsolete PSRR: 72dB ~ 58dB (120Hz ~ 1KHz) Voltage Dropout (Max): 212mV @ 1A Protection Features: Over Current, Over Temperature Current - Supply (Max): 7 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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EY1601SA-ADJ | Intel |
Description: IC REG LINEAR POS ADJ 50MA 8SOIC |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||
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ER3110DI | Intel |
Description: IC REG BUCK ADJUSTABLE 1A 12DFN Packaging: Cut Tape (CT) Package / Case: 12-VFDFN Exposed Pad Output Type: Adjustable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 1A Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Positive Frequency - Switching: 300kHz ~ 2MHz Voltage - Input (Max): 36V Topology: Buck Supplier Device Package: 12-DFN (4x3) Synchronous Rectifier: Yes Voltage - Output (Max): 34V Voltage - Input (Min): 3V Voltage - Output (Min/Fixed): 0.6V Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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ES1020QI | Intel | Description: IC CONTROLLER SEQUENCING 24QFN |
auf Bestellung 211 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||
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ES1022SI | Intel |
Description: IC CONTROLLER HOT SWAP 14SOIC Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Voltage - Input: 3.3V ~ 24V Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.3V ~ 24V Applications: Power Supply Sequencer Supplier Device Package: 14-SOIC Current - Supply: 286 µA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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EY1501DI-ADJ | Intel |
Description: IC REG LINEAR POS ADJ 1A 10DFN Packaging: Cut Tape (CT) Package / Case: 10-VFDFN Exposed Pad Output Type: Adjustable Mounting Type: Surface Mount Current - Output: 1A Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 5 mA Voltage - Input (Max): 6V Number of Regulators: 1 Supplier Device Package: 10-DFN (3x3) Voltage - Output (Max): 5V Voltage - Output (Min/Fixed): 0.8V Control Features: Enable, Power Good, Soft Start Part Status: Obsolete PSRR: 72dB ~ 58dB (120Hz ~ 1KHz) Voltage Dropout (Max): 212mV @ 1A Protection Features: Over Current, Over Temperature Current - Supply (Max): 7 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| ED8101P01QI | Intel |
Description: IC PWM CTRLR SGL TRUE DGTL 24QFN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| ED8101P02QI | Intel |
Description: IC PWM CTRLR SGL TRUE DGTL 24QFN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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ED8106N02QI | Intel |
Description: IC REG CTRLR BUCK 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Output Type: PWM Signal Mounting Type: Surface Mount Function: Step-Down Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: Positive Frequency - Switching: 500kHz ~ 1MHz Topology: Buck Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V Supplier Device Package: 24-QFN (4x4) Control Features: Power Good Output Phases: 1 Duty Cycle (Max): 100% Clock Sync: No Part Status: Obsolete Number of Outputs: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| EQC1241QI | Intel | Description: IC REG BUCK SYNC 2A 24QFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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EN23F2QI | Intel |
Description: DC DC CONVERTER 0.75-3.3V Features: Remote On/Off, OCP, OTP Packaging: Tape & Reel (TR) Package / Case: 92-PowerBFQFN Module Size / Dimension: 0.51" L x 0.47" W x 0.12" H (13.0mm x 12.0mm x 3.0mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: -40°C ~ 85°C Applications: ITE (Commercial) Voltage - Input (Max): 13.2V Efficiency: 91% Current - Output (Max): 15A Supplier Device Package: 92-QFN (13x12) Voltage - Input (Min): 4.5V Voltage - Output 1: 0.75 ~ 3.3V Control Features: Enable, Active High Number of Outputs: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| EN5310DC | Intel |
Description: DC DC CONVERTER 0.8-3.3V 3W Packaging: Tape & Reel (TR) Features: Remote On/Off, OCP, OTP, OVP Package / Case: 36-PowerDFN Module Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: 0°C ~ 70°C Applications: ITE (Commercial) Voltage - Input (Max): 5.5V Efficiency: 90% Current - Output (Max): 1A Supplier Device Package: 36-DFN (12.5x8.1) Voltage - Input (Min): 2.375V Voltage - Output 1: 0.8 ~ 3.3V Control Features: Enable, Active High Number of Outputs: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| EN5310DI | Intel |
Description: DC DC CONVERTER 0.8-3.3V 3W Packaging: Tape & Reel (TR) Features: Remote On/Off, OCP, OTP, OVP Package / Case: 36-PowerDFN Module Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: -40°C ~ 85°C Applications: ITE (Commercial) Voltage - Input (Max): 5.5V Efficiency: 90% Current - Output (Max): 1A Supplier Device Package: 36-DFN (12.5x8.1) Voltage - Input (Min): 2.375V Voltage - Output 1: 0.8 ~ 3.3V Control Features: Enable, Active High Number of Outputs: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| EN5312QI | Intel |
Description: DC DC CONVERTER 0.6-6V 6W |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| EN5330DC | Intel |
Description: DC DC CONVERTER 0.8-3.3V 10W Packaging: Tape & Reel (TR) Features: Remote On/Off, OCP, OTP, OVP, UVLO Package / Case: 36-PowerDFN Module Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: 0°C ~ 70°C Applications: ITE (Commercial) Voltage - Input (Max): 5.5V Efficiency: 90% Current - Output (Max): 3A Supplier Device Package: 36-DFN (12.5x8.1) Voltage - Input (Min): 2.375V Voltage - Output 1: 0.8 ~ 3.3V Control Features: Enable, Active High Number of Outputs: 1 |
Produkt ist nicht verfügbar |
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| EN5330DI | Intel |
Description: DC DC CONVERTER 0.8-3.3V 10W Packaging: Tape & Reel (TR) Features: Remote On/Off, OCP, OTP, OVP, UVLO Package / Case: 36-PowerDFN Module Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: -40°C ~ 85°C Applications: ITE (Commercial) Voltage - Input (Max): 5.5V Efficiency: 90% Current - Output (Max): 3A Supplier Device Package: 36-DFN (12.5x8.1) Voltage - Input (Min): 2.375V Voltage - Output 1: 0.8 ~ 3.3V Control Features: Enable, Active High Number of Outputs: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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5AGXBA1D4F27I5 | Intel |
Description: IC FPGA 336 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 336 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5AGXFB5K4F40I3 | Intel |
Description: IC FPGA 704 I/O 1517FBGA Packaging: Tray Package / Case: 1517-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.12V ~ 1.18V Number of Logic Elements/Cells: 420000 Supplier Device Package: 1517-FBGA (40x40) Number of LABs/CLBs: 19811 Total RAM Bits: 23625728 Part Status: Obsolete Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
 |
5AGXFB5K4F40I5 | Intel |
Description: IC FPGA 704 I/O 1517FBGA Packaging: Tray Package / Case: 1517-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 420000 Supplier Device Package: 1517-FBGA (40x40) Number of LABs/CLBs: 19811 Total RAM Bits: 23625728 Part Status: Obsolete Number of I/O: 704 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
 |
5ASXMB5E4F31I3N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 462K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA, FC (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
 |
5CEBA4F17I7 | Intel |
Description: IC FPGA 128 I/O 256FBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 49000 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 18480 Total RAM Bits: 3464192 Number of I/O: 128 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
 |
5CEFA2F23I7 | Intel |
Description: IC FPGA 224 I/O 484FBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
|
|
5CGXFC9A6U19I7 | Intel |
Description: IC FPGA 240 I/O 484UBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5M1270ZT144I5 | Intel |
Description: IC CPLD 980MC 6.2NS 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 980 Operating Temperature: -40°C ~ 100°C (TJ) Delay Time tpd(1) Max: 6.2 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 1270 Voltage Supply - Internal: 1.71V ~ 1.89V Part Status: Active Number of I/O: 114 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| 5SGXEA4H3F35I4 | Intel |
Description: IC FPGA 552 I/O 1152FBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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5SGXMA4H2F35I2 | Intel |
Description: IC FPGA 600 I/O 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 420000 Supplier Device Package: 1152-FBGA (35x35) Number of LABs/CLBs: 158500 Total RAM Bits: 37888000 Number of I/O: 600 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
 |
EP2AGX65CU17I3N | Intel |
Description: IC FPGA 156 I/O 358UBGA Packaging: Tray Package / Case: 358-LFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 60214 Supplier Device Package: 358-UBGA, FCBGA (17x17) Number of LABs/CLBs: 2530 Total RAM Bits: 5371904 Number of I/O: 156 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
 |
EP3C5M164I7 | Intel |
Description: IC FPGA 106 I/O 164MBGA Packaging: Tray Package / Case: 164-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 5136 Supplier Device Package: 164-MBGA (8x8) Number of LABs/CLBs: 321 Total RAM Bits: 423936 Part Status: Active Number of I/O: 106 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
 |
5SGXEA7N1F45I2 | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 622000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 234720 Total RAM Bits: 51200000 Number of I/O: 840 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
 |
10M08DAF484C8GES | Intel |
Description: IC FPGA 250 I/O 484FBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 5CSEBA2U23I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 256.50 EUR |
| 5CSEBA2U23I7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA4U19C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA4U19C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA4U19C7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA4U19C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA4U19C8SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA4U19I7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 207 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 220.76 EUR |
| 5CSEBA4U23A7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA4U23C7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA4U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA4U23C8SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 163.47 EUR |
| 5CSEBA4U23I7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA5U23I7 |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEMA2U23A7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEMA2U23C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEMA2U23C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEMA2U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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| 5CSEMA2U23I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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| 5CSEMA4U23A7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
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| 5CSEMA4U23C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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| 5CSEMA4U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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| EVB-ED8101P02QI |
Hersteller: Intel
Description: EVAL BOARD FOR ED8101
Packaging: Bulk
Function: Digital Power Controller
Type: Power Management
Utilized IC / Part: ED8101, ET4040
Supplied Contents: Board(s)
Description: EVAL BOARD FOR ED8101
Packaging: Bulk
Function: Digital Power Controller
Type: Power Management
Utilized IC / Part: ED8101, ET4040
Supplied Contents: Board(s)
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| EVB-ES1022SI |
|
Hersteller: Intel
Description: EVAL BOARD FOR ES1022
Description: EVAL BOARD FOR ES1022
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| EVB-EY1501DI-ADJ |
|
Hersteller: Intel
Description: EVAL BAORD FOR EY1501
Packaging: Bulk
Voltage - Output: 0.8V ~ 5V
Voltage - Input: 2.2V ~ 6V
Current - Output: 1A
Regulator Type: Positive Adjustable
Board Type: Fully Populated
Utilized IC / Part: EY1501DI-ADJ
Supplied Contents: Board(s)
Channels per IC: 1 - Single
Description: EVAL BAORD FOR EY1501
Packaging: Bulk
Voltage - Output: 0.8V ~ 5V
Voltage - Input: 2.2V ~ 6V
Current - Output: 1A
Regulator Type: Positive Adjustable
Board Type: Fully Populated
Utilized IC / Part: EY1501DI-ADJ
Supplied Contents: Board(s)
Channels per IC: 1 - Single
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| EVI-ED8100COMMIF |
Hersteller: Intel
Description: DONGLE FOR ED8100 SERIES
Packaging: Bulk
Accessory Type: Interface Board
Description: DONGLE FOR ED8100 SERIES
Packaging: Bulk
Accessory Type: Interface Board
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 243.44 EUR |
| ED8101P00QI |
Hersteller: Intel
Description: IC REG CTRLR BUCK I2C 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Output Type: PWM Signal
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz ~ 1MHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Supplier Device Package: 24-QFN (4x4)
Control Features: Power Good
Serial Interfaces: I²C
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Number of Outputs: 1
Description: IC REG CTRLR BUCK I2C 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Output Type: PWM Signal
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz ~ 1MHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Supplier Device Package: 24-QFN (4x4)
Control Features: Power Good
Serial Interfaces: I²C
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Number of Outputs: 1
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| ER3110DI |
|
Hersteller: Intel
Description: IC REG BUCK ADJUSTABLE 1A 12DFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 300kHz ~ 2MHz
Voltage - Input (Max): 36V
Topology: Buck
Supplier Device Package: 12-DFN (4x3)
Synchronous Rectifier: Yes
Voltage - Output (Max): 34V
Voltage - Input (Min): 3V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Obsolete
Description: IC REG BUCK ADJUSTABLE 1A 12DFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 300kHz ~ 2MHz
Voltage - Input (Max): 36V
Topology: Buck
Supplier Device Package: 12-DFN (4x3)
Synchronous Rectifier: Yes
Voltage - Output (Max): 34V
Voltage - Input (Min): 3V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Obsolete
Produkt ist nicht verfügbar
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| ES1020QI |
Hersteller: Intel
Description: IC CONTROLLER SEQUENCING 24QFN
Description: IC CONTROLLER SEQUENCING 24QFN
Produkt ist nicht verfügbar
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| ES1022SI |
|
Hersteller: Intel
Description: IC CONTROLLER HOT SWAP 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 3.3V ~ 24V
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V ~ 24V
Applications: Power Supply Sequencer
Supplier Device Package: 14-SOIC
Current - Supply: 286 µA
DigiKey Programmable: Not Verified
Description: IC CONTROLLER HOT SWAP 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 3.3V ~ 24V
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V ~ 24V
Applications: Power Supply Sequencer
Supplier Device Package: 14-SOIC
Current - Supply: 286 µA
DigiKey Programmable: Not Verified
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| EY1501DI-ADJ |
|
Hersteller: Intel
Description: IC REG LINEAR POS ADJ 1A 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 5 mA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: 10-DFN (3x3)
Voltage - Output (Max): 5V
Voltage - Output (Min/Fixed): 0.8V
Control Features: Enable, Power Good, Soft Start
Part Status: Obsolete
PSRR: 72dB ~ 58dB (120Hz ~ 1KHz)
Voltage Dropout (Max): 212mV @ 1A
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 7 mA
Description: IC REG LINEAR POS ADJ 1A 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 5 mA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: 10-DFN (3x3)
Voltage - Output (Max): 5V
Voltage - Output (Min/Fixed): 0.8V
Control Features: Enable, Power Good, Soft Start
Part Status: Obsolete
PSRR: 72dB ~ 58dB (120Hz ~ 1KHz)
Voltage Dropout (Max): 212mV @ 1A
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 7 mA
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| EY1601SA-ADJ |
|
Hersteller: Intel
Description: IC REG LINEAR POS ADJ 50MA 8SOIC
Description: IC REG LINEAR POS ADJ 50MA 8SOIC
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| ER3110DI |
|
Hersteller: Intel
Description: IC REG BUCK ADJUSTABLE 1A 12DFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 300kHz ~ 2MHz
Voltage - Input (Max): 36V
Topology: Buck
Supplier Device Package: 12-DFN (4x3)
Synchronous Rectifier: Yes
Voltage - Output (Max): 34V
Voltage - Input (Min): 3V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Obsolete
Description: IC REG BUCK ADJUSTABLE 1A 12DFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 300kHz ~ 2MHz
Voltage - Input (Max): 36V
Topology: Buck
Supplier Device Package: 12-DFN (4x3)
Synchronous Rectifier: Yes
Voltage - Output (Max): 34V
Voltage - Input (Min): 3V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
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| ES1020QI |
Hersteller: Intel
Description: IC CONTROLLER SEQUENCING 24QFN
Description: IC CONTROLLER SEQUENCING 24QFN
auf Bestellung 211 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| ES1022SI |
|
Hersteller: Intel
Description: IC CONTROLLER HOT SWAP 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 3.3V ~ 24V
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V ~ 24V
Applications: Power Supply Sequencer
Supplier Device Package: 14-SOIC
Current - Supply: 286 µA
DigiKey Programmable: Not Verified
Description: IC CONTROLLER HOT SWAP 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 3.3V ~ 24V
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V ~ 24V
Applications: Power Supply Sequencer
Supplier Device Package: 14-SOIC
Current - Supply: 286 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| EY1501DI-ADJ |
|
Hersteller: Intel
Description: IC REG LINEAR POS ADJ 1A 10DFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 5 mA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: 10-DFN (3x3)
Voltage - Output (Max): 5V
Voltage - Output (Min/Fixed): 0.8V
Control Features: Enable, Power Good, Soft Start
Part Status: Obsolete
PSRR: 72dB ~ 58dB (120Hz ~ 1KHz)
Voltage Dropout (Max): 212mV @ 1A
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 7 mA
Description: IC REG LINEAR POS ADJ 1A 10DFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 5 mA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: 10-DFN (3x3)
Voltage - Output (Max): 5V
Voltage - Output (Min/Fixed): 0.8V
Control Features: Enable, Power Good, Soft Start
Part Status: Obsolete
PSRR: 72dB ~ 58dB (120Hz ~ 1KHz)
Voltage Dropout (Max): 212mV @ 1A
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 7 mA
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| ED8106N02QI |
Hersteller: Intel
Description: IC REG CTRLR BUCK 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Output Type: PWM Signal
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz ~ 1MHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Supplier Device Package: 24-QFN (4x4)
Control Features: Power Good
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Part Status: Obsolete
Number of Outputs: 1
Description: IC REG CTRLR BUCK 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Output Type: PWM Signal
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz ~ 1MHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Supplier Device Package: 24-QFN (4x4)
Control Features: Power Good
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Part Status: Obsolete
Number of Outputs: 1
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| EQC1241QI |
Hersteller: Intel
Description: IC REG BUCK SYNC 2A 24QFN
Description: IC REG BUCK SYNC 2A 24QFN
Produkt ist nicht verfügbar
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| EN23F2QI |
|
Hersteller: Intel
Description: DC DC CONVERTER 0.75-3.3V
Features: Remote On/Off, OCP, OTP
Packaging: Tape & Reel (TR)
Package / Case: 92-PowerBFQFN Module
Size / Dimension: 0.51" L x 0.47" W x 0.12" H (13.0mm x 12.0mm x 3.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 13.2V
Efficiency: 91%
Current - Output (Max): 15A
Supplier Device Package: 92-QFN (13x12)
Voltage - Input (Min): 4.5V
Voltage - Output 1: 0.75 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
Description: DC DC CONVERTER 0.75-3.3V
Features: Remote On/Off, OCP, OTP
Packaging: Tape & Reel (TR)
Package / Case: 92-PowerBFQFN Module
Size / Dimension: 0.51" L x 0.47" W x 0.12" H (13.0mm x 12.0mm x 3.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 13.2V
Efficiency: 91%
Current - Output (Max): 15A
Supplier Device Package: 92-QFN (13x12)
Voltage - Input (Min): 4.5V
Voltage - Output 1: 0.75 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
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| EN5310DC |
Hersteller: Intel
Description: DC DC CONVERTER 0.8-3.3V 3W
Packaging: Tape & Reel (TR)
Features: Remote On/Off, OCP, OTP, OVP
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: 0°C ~ 70°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 1A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
Description: DC DC CONVERTER 0.8-3.3V 3W
Packaging: Tape & Reel (TR)
Features: Remote On/Off, OCP, OTP, OVP
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: 0°C ~ 70°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 1A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
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| EN5310DI |
Hersteller: Intel
Description: DC DC CONVERTER 0.8-3.3V 3W
Packaging: Tape & Reel (TR)
Features: Remote On/Off, OCP, OTP, OVP
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 1A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
Description: DC DC CONVERTER 0.8-3.3V 3W
Packaging: Tape & Reel (TR)
Features: Remote On/Off, OCP, OTP, OVP
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 1A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
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| EN5312QI |
|
Hersteller: Intel
Description: DC DC CONVERTER 0.6-6V 6W
Description: DC DC CONVERTER 0.6-6V 6W
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| EN5330DC |
|
Hersteller: Intel
Description: DC DC CONVERTER 0.8-3.3V 10W
Packaging: Tape & Reel (TR)
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: 0°C ~ 70°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 3A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
Description: DC DC CONVERTER 0.8-3.3V 10W
Packaging: Tape & Reel (TR)
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: 0°C ~ 70°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 3A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
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| EN5330DI |
|
Hersteller: Intel
Description: DC DC CONVERTER 0.8-3.3V 10W
Packaging: Tape & Reel (TR)
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 3A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
Description: DC DC CONVERTER 0.8-3.3V 10W
Packaging: Tape & Reel (TR)
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 3A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
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| 5AGXBA1D4F27I5 |
|
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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| 5AGXFB5K4F40I3 |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1517-FBGA (40x40)
Number of LABs/CLBs: 19811
Total RAM Bits: 23625728
Part Status: Obsolete
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1517-FBGA (40x40)
Number of LABs/CLBs: 19811
Total RAM Bits: 23625728
Part Status: Obsolete
Number of I/O: 704
DigiKey Programmable: Not Verified
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| 5AGXFB5K4F40I5 |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1517-FBGA (40x40)
Number of LABs/CLBs: 19811
Total RAM Bits: 23625728
Part Status: Obsolete
Number of I/O: 704
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1517-FBGA (40x40)
Number of LABs/CLBs: 19811
Total RAM Bits: 23625728
Part Status: Obsolete
Number of I/O: 704
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| 5ASXMB5E4F31I3N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA, FC (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA, FC (31x31)
Architecture: MCU, FPGA
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| 5CEBA4F17I7 |
|
Hersteller: Intel
Description: IC FPGA 128 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 49000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 18480
Total RAM Bits: 3464192
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC FPGA 128 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 49000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 18480
Total RAM Bits: 3464192
Number of I/O: 128
DigiKey Programmable: Not Verified
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| 5CEFA2F23I7 |
|
Hersteller: Intel
Description: IC FPGA 224 I/O 484FBGA
Description: IC FPGA 224 I/O 484FBGA
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| 5CGXFC9A6U19I7 |
|
Hersteller: Intel
Description: IC FPGA 240 I/O 484UBGA
Description: IC FPGA 240 I/O 484UBGA
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| 5M1270ZT144I5 |
Hersteller: Intel
Description: IC CPLD 980MC 6.2NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 114
DigiKey Programmable: Not Verified
Description: IC CPLD 980MC 6.2NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 114
DigiKey Programmable: Not Verified
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| 5SGXEA4H3F35I4 |
|
Hersteller: Intel
Description: IC FPGA 552 I/O 1152FBGA
Description: IC FPGA 552 I/O 1152FBGA
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| 5SGXMA4H2F35I2 |
|
Hersteller: Intel
Description: IC FPGA 600 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 158500
Total RAM Bits: 37888000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 158500
Total RAM Bits: 37888000
Number of I/O: 600
DigiKey Programmable: Not Verified
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| EP2AGX65CU17I3N |
|
Hersteller: Intel
Description: IC FPGA 156 I/O 358UBGA
Packaging: Tray
Package / Case: 358-LFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 60214
Supplier Device Package: 358-UBGA, FCBGA (17x17)
Number of LABs/CLBs: 2530
Total RAM Bits: 5371904
Number of I/O: 156
DigiKey Programmable: Not Verified
Description: IC FPGA 156 I/O 358UBGA
Packaging: Tray
Package / Case: 358-LFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 60214
Supplier Device Package: 358-UBGA, FCBGA (17x17)
Number of LABs/CLBs: 2530
Total RAM Bits: 5371904
Number of I/O: 156
DigiKey Programmable: Not Verified
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| EP3C5M164I7 |
|
Hersteller: Intel
Description: IC FPGA 106 I/O 164MBGA
Packaging: Tray
Package / Case: 164-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 5136
Supplier Device Package: 164-MBGA (8x8)
Number of LABs/CLBs: 321
Total RAM Bits: 423936
Part Status: Active
Number of I/O: 106
DigiKey Programmable: Not Verified
Description: IC FPGA 106 I/O 164MBGA
Packaging: Tray
Package / Case: 164-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 5136
Supplier Device Package: 164-MBGA (8x8)
Number of LABs/CLBs: 321
Total RAM Bits: 423936
Part Status: Active
Number of I/O: 106
DigiKey Programmable: Not Verified
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| 5SGXEA7N1F45I2 |
|
Hersteller: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 622000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 234720
Total RAM Bits: 51200000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 622000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 234720
Total RAM Bits: 51200000
Number of I/O: 840
DigiKey Programmable: Not Verified
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| 10M08DAF484C8GES |
|
Hersteller: Intel
Description: IC FPGA 250 I/O 484FBGA
Description: IC FPGA 250 I/O 484FBGA
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