Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (338191) > Seite 1045 nach 5637
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
||||
---|---|---|---|---|---|---|---|---|---|
M2S025T-VF256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
||||||
M2S025T-VFG256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
||||||
M2S025-VF256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
||||||
M2S025-VF256I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
||||||
M2S025-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
||||||
M2S025-VFG256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
||||||
M2S025-VFG256I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
auf Bestellung 139 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
M2S050-FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 50K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
auf Bestellung 139 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
M2S050T-FG484I | Microchip Technology | Description: IC SOC CORTEX-M3 166MHZ 484FBGA |
Produkt ist nicht verfügbar |
||||||
M2S050TS-VF400 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 50K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
||||||
M2S050TS-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 50K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
||||||
M2S050-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 50K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
||||||
M2S060-1FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
auf Bestellung 176 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
M2S060-FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
auf Bestellung 819 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
M2S060T-1FGG484I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 484FBGA Packaging: Tray Package / Case: 484-BGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 484-FPBGA (23x23) Architecture: MCU, FPGA Flash Size: 256KB |
auf Bestellung 60 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
M2S060TS-VF400 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
||||||
M2S060TS-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
||||||
M2S090-FGG484I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 484FBGA Packaging: Tray Package / Case: 484-BGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 90K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 484-FPBGA (23x23) Architecture: MCU, FPGA Flash Size: 512KB Part Status: Active |
auf Bestellung 108 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
M2S090TS-1FCS325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 90K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x13.5) Architecture: MCU, FPGA Flash Size: 512KB |
auf Bestellung 704 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
M2S150-1FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150-1FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150-1FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150-1FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150-FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150-FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150-FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150-FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150-FCVG484I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 484FBGA Packaging: Tray Package / Case: 484-BFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 484-FBGA (19x19) Architecture: MCU, FPGA Flash Size: 512KB Part Status: Active |
auf Bestellung 120 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
M2S150T-1FC1152M | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 1152BGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -55°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 1152-FCBGA (35x35) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150T-1FCG1152M | Microchip Technology | Description: IC SOC CORTEX-M3 166MHZ 1152BGA |
auf Bestellung 24 Stücke: Lieferzeit 21-28 Tag (e) |
||||||
M2S150T-1FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150T-1FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150T-1FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150T-1FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150T-FCG1152I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 1152BGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 1152-FCBGA (35x35) Architecture: MCU, FPGA Flash Size: 512KB Part Status: Active |
auf Bestellung 40 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
M2S150T-FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150T-FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150T-FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150T-FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150TS-1FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150TS-1FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150TS-1FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150TS-1FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150TS-FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150TS-FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150TS-FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
M2S150TS-FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
||||||
MAQ5300-3.0YML-TR | Microchip Technology | Description: IC REG LDO 3V 0.3A 6DFN |
Produkt ist nicht verfügbar |
||||||
MAQ5300-3.0YML-TR | Microchip Technology | Description: IC REG LDO 3V 0.3A 6DFN |
Produkt ist nicht verfügbar |
||||||
ATMEGA328PB-XMINI | Microchip Technology |
Description: ATMEGA328PB XPLAINED MINI BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: AVR Board Type: Evaluation Platform Utilized IC / Part: ATmega328PB Platform: ATmega328PB Xplained Mini Part Status: Active |
auf Bestellung 104 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
MTCH102T-I/MS | Microchip Technology |
Description: IC PROXIMITY DETECTOR 8MSOP Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: Open Drain Type: Buttons Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.05V ~ 3.6V Current - Supply: 80mA Number of Inputs: Up to 2 Supplier Device Package: 8-MSOP Proximity Detection: Yes LED Driver Channels: Up to 2 DigiKey Programmable: Not Verified |
auf Bestellung 5000 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
MTCH102T-I/MU | Microchip Technology |
Description: IC PROXIMITY DETECTOR 8UDFN Packaging: Tape & Reel (TR) Package / Case: 8-UDFN Exposed Pad Mounting Type: Surface Mount Interface: Open Drain Type: Buttons Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.05V ~ 3.6V Current - Supply: 80mA Number of Inputs: Up to 2 Supplier Device Package: 8-UDFN (3x3) Proximity Detection: Yes LED Driver Channels: Up to 2 Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||
MTCH105T-I/ST | Microchip Technology |
Description: IC PROXIMITY DETECTOR 14TSSOP Packaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Interface: Open Drain Type: Buttons Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.05V ~ 3.6V Current - Supply: 80mA Number of Inputs: Up to 5 Supplier Device Package: 14-TSSOP Proximity Detection: Yes LED Driver Channels: Up to 5 Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 7500 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
MTCH108T-I/GZ | Microchip Technology |
Description: IC PROXIMITY DETECTOR 20UQFN Packaging: Tape & Reel (TR) Package / Case: 20-UFQFN Exposed Pad Mounting Type: Surface Mount Interface: Open Drain Type: Buttons Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.05V ~ 3.6V Current - Supply: 80mA Number of Inputs: Up to 8 Supplier Device Package: 20-UQFN (4x4) Proximity Detection: Yes LED Driver Channels: Up to 8 Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||
MTCH108T-I/SS | Microchip Technology |
Description: IC PROXIMITY DETECTOR 20SSOP Packaging: Tape & Reel (TR) Package / Case: 20-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Interface: Open Drain Type: Buttons Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.05V ~ 3.6V Current - Supply: 80mA Number of Inputs: Up to 8 Supplier Device Package: 20-SSOP Proximity Detection: Yes LED Driver Channels: Up to 8 DigiKey Programmable: Not Verified |
auf Bestellung 1600 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
ATSAML21-XPRO-B | Microchip Technology |
Description: SAM L21 XPLAINED PRO ATSAML21 Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: ATSAML21 Platform: SAM L21 Xplained Pro Part Status: Active |
auf Bestellung 38 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||
JAN1N1190 | Microchip Technology | Description: DIODE GEN PURP 600V 35A DO5 |
Produkt ist nicht verfügbar |
||||||
JANTXV1N1190 | Microchip Technology | Description: DIODE GEN PURP 600V 35A DO5 |
Produkt ist nicht verfügbar |
||||||
JAN1N1190R | Microchip Technology | Description: DIODE GEN PURP REV 600V 35A DO5 |
Produkt ist nicht verfügbar |
||||||
JANTXV1N1190R | Microchip Technology | Description: DIODE GEN PURP REV 600V 35A DO5 |
Produkt ist nicht verfügbar |
M2S025T-VF256 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025T-VFG256 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-VF256 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-VF256I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-VF400I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-VFG256 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-VFG256I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
auf Bestellung 139 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 223.81 EUR |
100+ | 220.54 EUR |
M2S050-FCSG325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
auf Bestellung 139 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 284.31 EUR |
M2S050T-FG484I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Produkt ist nicht verfügbar
M2S050TS-VF400 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S050TS-VF400I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S050-VF400I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S060-1FCSG325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
auf Bestellung 176 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 318.34 EUR |
M2S060-FCSG325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
auf Bestellung 819 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 284.31 EUR |
M2S060T-1FGG484I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 256KB
auf Bestellung 60 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 446.08 EUR |
M2S060TS-VF400 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S060TS-VF400I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S090-FGG484I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
auf Bestellung 108 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 629.28 EUR |
M2S090TS-1FCS325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x13.5)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x13.5)
Architecture: MCU, FPGA
Flash Size: 512KB
auf Bestellung 704 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 581.67 EUR |
M2S150-1FCS536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-1FCS536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-1FCSG536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-1FCSG536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-FCS536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-FCS536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-FCSG536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-FCSG536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-FCVG484I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FBGA (19x19)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FBGA (19x19)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
auf Bestellung 120 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 965.51 EUR |
M2S150T-1FC1152M |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -55°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -55°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150T-1FCG1152M |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
auf Bestellung 24 Stücke:
Lieferzeit 21-28 Tag (e)M2S150T-1FCS536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150T-1FCS536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150T-1FCSG536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150T-1FCSG536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150T-FCG1152I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 1150.19 EUR |
M2S150T-FCS536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150T-FCS536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150T-FCSG536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150T-FCSG536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150TS-1FCS536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150TS-1FCS536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150TS-1FCSG536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150TS-1FCSG536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150TS-FCS536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150TS-FCS536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150TS-FCSG536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150TS-FCSG536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
MAQ5300-3.0YML-TR |
Hersteller: Microchip Technology
Description: IC REG LDO 3V 0.3A 6DFN
Description: IC REG LDO 3V 0.3A 6DFN
Produkt ist nicht verfügbar
MAQ5300-3.0YML-TR |
Hersteller: Microchip Technology
Description: IC REG LDO 3V 0.3A 6DFN
Description: IC REG LDO 3V 0.3A 6DFN
Produkt ist nicht verfügbar
ATMEGA328PB-XMINI |
Hersteller: Microchip Technology
Description: ATMEGA328PB XPLAINED MINI BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: AVR
Board Type: Evaluation Platform
Utilized IC / Part: ATmega328PB
Platform: ATmega328PB Xplained Mini
Part Status: Active
Description: ATMEGA328PB XPLAINED MINI BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: AVR
Board Type: Evaluation Platform
Utilized IC / Part: ATmega328PB
Platform: ATmega328PB Xplained Mini
Part Status: Active
auf Bestellung 104 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 37.15 EUR |
MTCH102T-I/MS |
Hersteller: Microchip Technology
Description: IC PROXIMITY DETECTOR 8MSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 2
Supplier Device Package: 8-MSOP
Proximity Detection: Yes
LED Driver Channels: Up to 2
DigiKey Programmable: Not Verified
Description: IC PROXIMITY DETECTOR 8MSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 2
Supplier Device Package: 8-MSOP
Proximity Detection: Yes
LED Driver Channels: Up to 2
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 1.81 EUR |
MTCH102T-I/MU |
Hersteller: Microchip Technology
Description: IC PROXIMITY DETECTOR 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UDFN Exposed Pad
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 2
Supplier Device Package: 8-UDFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 2
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC PROXIMITY DETECTOR 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UDFN Exposed Pad
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 2
Supplier Device Package: 8-UDFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 2
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MTCH105T-I/ST |
Hersteller: Microchip Technology
Description: IC PROXIMITY DETECTOR 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 5
Supplier Device Package: 14-TSSOP
Proximity Detection: Yes
LED Driver Channels: Up to 5
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC PROXIMITY DETECTOR 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 5
Supplier Device Package: 14-TSSOP
Proximity Detection: Yes
LED Driver Channels: Up to 5
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 7500 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 2.21 EUR |
MTCH108T-I/GZ |
Hersteller: Microchip Technology
Description: IC PROXIMITY DETECTOR 20UQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 8
Supplier Device Package: 20-UQFN (4x4)
Proximity Detection: Yes
LED Driver Channels: Up to 8
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC PROXIMITY DETECTOR 20UQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 8
Supplier Device Package: 20-UQFN (4x4)
Proximity Detection: Yes
LED Driver Channels: Up to 8
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MTCH108T-I/SS |
Hersteller: Microchip Technology
Description: IC PROXIMITY DETECTOR 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 8
Supplier Device Package: 20-SSOP
Proximity Detection: Yes
LED Driver Channels: Up to 8
DigiKey Programmable: Not Verified
Description: IC PROXIMITY DETECTOR 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 8
Supplier Device Package: 20-SSOP
Proximity Detection: Yes
LED Driver Channels: Up to 8
DigiKey Programmable: Not Verified
auf Bestellung 1600 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1600+ | 2.47 EUR |
ATSAML21-XPRO-B |
Hersteller: Microchip Technology
Description: SAM L21 XPLAINED PRO ATSAML21
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: ATSAML21
Platform: SAM L21 Xplained Pro
Part Status: Active
Description: SAM L21 XPLAINED PRO ATSAML21
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: ATSAML21
Platform: SAM L21 Xplained Pro
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 244.69 EUR |
JAN1N1190 |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 600V 35A DO5
Description: DIODE GEN PURP 600V 35A DO5
Produkt ist nicht verfügbar
JANTXV1N1190 |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 600V 35A DO5
Description: DIODE GEN PURP 600V 35A DO5
Produkt ist nicht verfügbar
JAN1N1190R |
Hersteller: Microchip Technology
Description: DIODE GEN PURP REV 600V 35A DO5
Description: DIODE GEN PURP REV 600V 35A DO5
Produkt ist nicht verfügbar
JANTXV1N1190R |
Hersteller: Microchip Technology
Description: DIODE GEN PURP REV 600V 35A DO5
Description: DIODE GEN PURP REV 600V 35A DO5
Produkt ist nicht verfügbar