Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (358216) > Seite 1250 nach 5971
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ATSAME54N20A-AUT-EFP | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 100-TQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4F Data Converters: A/D 28x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 81 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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ATSAMD51J18A-MUT-EFP | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 51 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MIC33M656-FAYMP-TR | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 53-PowerBFQFN Module Output Type: Programmable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 6A Operating Temperature: -40°C ~ 125°C (TJ) Output Configuration: Positive Frequency - Switching: 1.6MHz, 2.2MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 53-B1QFN (6x10) Synchronous Rectifier: Yes Voltage - Output (Max): 1.28V Voltage - Input (Min): 2.4V Voltage - Output (Min/Fixed): 0.6V Part Status: Active |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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ATSAME51J18A-AUT-EFP | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 51 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SAM9X60T-V/DWB | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 228-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 228-TFBGA (11x11) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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SAM9X60-V/DWB | Microchip Technology |
![]() Packaging: Tray Package / Case: 228-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 228-TFBGA (11x11) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
auf Bestellung 1142 Stücke: Lieferzeit 10-14 Tag (e) |
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SAM9X60T-V/DWB | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 228-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 228-TFBGA (11x11) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
auf Bestellung 3112 Stücke: Lieferzeit 10-14 Tag (e) |
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DSC1221NI2-125M0000 | Microchip Technology |
![]() Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 27mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 125 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1222NI2-156M2500 | Microchip Technology |
![]() Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 50mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 156.25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1221CL2-25M00000 | Microchip Technology |
![]() Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 27mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1221DA2-25M00000 | Microchip Technology |
![]() Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 125°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 27mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1222NI2-150M0000 | Microchip Technology |
![]() Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 50mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 150 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1222DI2-156M2500 | Microchip Technology |
![]() Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 50mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 156.25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1223DI2-150M0000 | Microchip Technology |
![]() Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: LVDS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 32mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 150 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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MRF89XAM9AT-I/RM | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 12-SMD Module Sensitivity: -111dBm Mounting Type: Surface Mount Frequency: 902MHz ~ 928MHz Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.1V ~ 3.6V Power - Output: 12.5dBm Data Rate: 200kbps Current - Receiving: 3mA Current - Transmitting: 16mA ~ 25mA Antenna Type: Integrated, Trace Utilized IC / Part: MRF89XAM9A Modulation: FSK, OOK RF Family/Standard: General ISM < 1GHz Serial Interfaces: SPI Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 4500 Stücke: Lieferzeit 10-14 Tag (e) |
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DSC1222CI2-25M00000 | Microchip Technology |
![]() Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 50mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1223DI2-212M5000 | Microchip Technology |
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DSC1222CI2-212M5000 | Microchip Technology |
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DSC1223BI2-156M2500 | Microchip Technology |
![]() Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Output: LVDS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 32mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 156.25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1223CI2-133M3333 | Microchip Technology |
![]() Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: LVDS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 32mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 133.333 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1224DI2-125M0000 | Microchip Technology |
![]() Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: HCSL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 40mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 125 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1224DL1-100M0000 | Microchip Technology |
![]() Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: HCSL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 40mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 100 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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MRF89XAM9AT-I/RM | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 12-SMD Module Sensitivity: -111dBm Mounting Type: Surface Mount Frequency: 902MHz ~ 928MHz Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.1V ~ 3.6V Power - Output: 12.5dBm Data Rate: 200kbps Current - Receiving: 3mA Current - Transmitting: 16mA ~ 25mA Antenna Type: Integrated, Trace Utilized IC / Part: MRF89XAM9A Modulation: FSK, OOK RF Family/Standard: General ISM < 1GHz Serial Interfaces: SPI Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 5582 Stücke: Lieferzeit 10-14 Tag (e) |
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SAM9X60D5M-I/4FB | Microchip Technology |
![]() Packaging: Tray Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
auf Bestellung 130 Stücke: Lieferzeit 10-14 Tag (e) |
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SAM9X60D5MT-I/4FB | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
Produkt ist nicht verfügbar |
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SAM9X60D1G-I/4FB | Microchip Technology |
![]() Packaging: Tray Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
auf Bestellung 303 Stücke: Lieferzeit 10-14 Tag (e) |
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SAM9X60D1GT-I/4FB | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
Produkt ist nicht verfügbar |
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SAM9X60D5MT-I/4FB | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
Produkt ist nicht verfügbar |
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SAM9X60D1GT-I/4FB | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
Produkt ist nicht verfügbar |
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ATSAMA5D27C-D1G-CUR | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 289-TFBGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 289-TFBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + HSIC Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI |
auf Bestellung 1911 Stücke: Lieferzeit 10-14 Tag (e) |
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ATECC608A-TNGTLSU-B | Microchip Technology | Description: TRUST & GO TLS I2C PROTO 8-UDFN |
Produkt ist nicht verfügbar |
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ATECC608A-TNGLORAS-G | Microchip Technology | Description: TRUST & GO LORAWAN I2C PROVISION |
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ATECC608A-TNGTLSS-C | Microchip Technology | Description: TRUST & GO TLS I2C PROVISIONED 8 |
Produkt ist nicht verfügbar |
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ATECC608A-TNGLORAU-C | Microchip Technology | Description: TRUST & GO LORAWAN I2C PROVISION |
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ATECC608A-TNGLORAU-G | Microchip Technology | Description: TRUST & GO LORAWAN I2C PROVISION |
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ATECC608A-TNGTLSU-C | Microchip Technology | Description: TRUST & GO TLS I2C PROVISIONED 8 |
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ATECC608A-TNGLORAS-C | Microchip Technology | Description: TRUST & GO LORAWAN I2C PROVISION |
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ATECC608A-TNGTLSS-B | Microchip Technology | Description: TRUST & GO TLS I2C PROTO 8-SOIC |
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ATECC608A-TNGTLSS-G | Microchip Technology | Description: TRUST & GO TLS I2C PROVISIONED 8 |
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ATECC608A-TNGLORAS-B | Microchip Technology | Description: TRUST & GO LORAWAN I2C PROTO 8-S |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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ATECC608A-TNGTLSU-G | Microchip Technology | Description: TRUST & GO TLS I2C PROVISIONED 8 |
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ATECC608A-TNGLORAU-B | Microchip Technology | Description: TRUST & GO LORAWAN I2C PROTO 8-U |
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KSZ9131MNXC-TR | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V Number of Drivers/Receivers: 8/8 Data Rate: 10Mbps, 100Mbps, 1Gbps Protocol: Gigabit Ethernet Supplier Device Package: 64-QFN (8x8) Receiver Hysteresis: 500 mV Duplex: Full, Half Part Status: Active |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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DT100108 | Microchip Technology |
![]() Packaging: Bulk Voltage - Output: 0.6V, 3.84V Voltage - Input: 2.4V ~ 5.5V Current - Output: 6A Contents: Board(s) Frequency - Switching: 2.2MHz Regulator Topology: Buck Board Type: Fully Populated Utilized IC / Part: MIC33M656 Supplied Contents: Board(s) Main Purpose: DC/DC, Step Down Outputs and Type: 1 Non-Isolated Output Part Status: Active |
Produkt ist nicht verfügbar |
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RN4870-I/RM140 | Microchip Technology |
![]() Packaging: Tray Package / Case: 33-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.402GHz ~ 2.48GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 0dBm Data Rate: 10kbps Protocol: Bluetooth v5.0 Current - Receiving: 13mA Current - Transmitting: 13mA Antenna Type: Integrated, Chip Utilized IC / Part: RN4870 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 761 Stücke: Lieferzeit 10-14 Tag (e) |
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KSZ9131RNXC-TR | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V Number of Drivers/Receivers: 4/4 Data Rate: 10Mbps, 100Mbps, 1Gbps Protocol: Gigabit Ethernet Supplier Device Package: 48-QFN (7x7) Receiver Hysteresis: 500 mV Duplex: Full, Half Part Status: Active |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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KSZ9131MNXI | Microchip Technology |
![]() Packaging: Tray Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V Number of Drivers/Receivers: 8/8 Data Rate: 10Mbps, 100Mbps, 1Gbps Protocol: Gigabit Ethernet Supplier Device Package: 64-QFN (8x8) Receiver Hysteresis: 500 mV Duplex: Full, Half |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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KSZ9131MNXI-TR | Microchip Technology |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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KSZ9131MNXC | Microchip Technology |
![]() Packaging: Tray Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V Number of Drivers/Receivers: 8/8 Data Rate: 10Mbps, 100Mbps, 1Gbps Protocol: Gigabit Ethernet Supplier Device Package: 64-QFN (8x8) Receiver Hysteresis: 500 mV Duplex: Full, Half Part Status: Active |
auf Bestellung 201 Stücke: Lieferzeit 10-14 Tag (e) |
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RN4871-V/RM140 | Microchip Technology |
![]() Packaging: Tray Package / Case: 16-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.402GHz ~ 2.48GHz Operating Temperature: -20°C ~ 70°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 0dBm Data Rate: 10kbps Protocol: Bluetooth v5.0 Current - Receiving: 13mA Current - Transmitting: 13mA Antenna Type: Integrated, Chip Utilized IC / Part: RN4871 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 349 Stücke: Lieferzeit 10-14 Tag (e) |
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KSZ9131RNXI-TR | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V Number of Drivers/Receivers: 4/4 Data Rate: 10Mbps, 100Mbps, 1Gbps Protocol: Gigabit Ethernet Supplier Device Package: 48-QFN (7x7) Receiver Hysteresis: 500 mV Duplex: Full, Half |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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DT100107 | Microchip Technology |
![]() Packaging: Bulk Voltage - Output: 0.6V, 0.8V, 0.9V, 1V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V Voltage - Input: 2.4V ~ 5.5V Current - Output: 6A Contents: Board(s) Frequency - Switching: 2MHz Regulator Topology: Buck Board Type: Fully Populated Supplied Contents: Board(s) Main Purpose: DC/DC, Step Down Outputs and Type: 9 Non-Isolated Outputs Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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RN4870-V/RM140 | Microchip Technology |
![]() Packaging: Tray Package / Case: 33-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.402GHz ~ 2.48GHz Operating Temperature: -20°C ~ 70°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 0dBm Data Rate: 10kbps Protocol: Bluetooth v5.0 Current - Receiving: 13mA Current - Transmitting: 13mA Antenna Type: Integrated, Chip Utilized IC / Part: RN4870 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 10082 Stücke: Lieferzeit 10-14 Tag (e) |
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KSZ9131RNXC | Microchip Technology |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V Number of Drivers/Receivers: 4/4 Data Rate: 10Mbps, 100Mbps, 1Gbps Protocol: Gigabit Ethernet Supplier Device Package: 48-QFN (7x7) Receiver Hysteresis: 500 mV Duplex: Full, Half |
auf Bestellung 307 Stücke: Lieferzeit 10-14 Tag (e) |
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BM64SPKS1MC2-0002AA | Microchip Technology |
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auf Bestellung 1455 Stücke: Lieferzeit 10-14 Tag (e) |
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KSZ9131RNXI | Microchip Technology |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V Number of Drivers/Receivers: 4/4 Data Rate: 10Mbps, 100Mbps, 1Gbps Protocol: Gigabit Ethernet Supplier Device Package: 48-QFN (7x7) Receiver Hysteresis: 500 mV Duplex: Full, Half |
auf Bestellung 422 Stücke: Lieferzeit 10-14 Tag (e) |
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RN4871-I/RM140 | Microchip Technology |
![]() Packaging: Tray Package / Case: 16-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.402GHz ~ 2.48GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 0dBm Data Rate: 10kbps Protocol: Bluetooth v5.0 Current - Receiving: 13mA Current - Transmitting: 13mA Antenna Type: Integrated, Chip Utilized IC / Part: RN4871 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 2280 Stücke: Lieferzeit 10-14 Tag (e) |
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KSZ9131MNXI-TR | Microchip Technology |
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auf Bestellung 736 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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KSZ9131RNXC-TR | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V Number of Drivers/Receivers: 4/4 Data Rate: 10Mbps, 100Mbps, 1Gbps Protocol: Gigabit Ethernet Supplier Device Package: 48-QFN (7x7) Receiver Hysteresis: 500 mV Duplex: Full, Half Part Status: Active |
auf Bestellung 1924 Stücke: Lieferzeit 10-14 Tag (e) |
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KSZ9131MNXC-TR | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V Number of Drivers/Receivers: 8/8 Data Rate: 10Mbps, 100Mbps, 1Gbps Protocol: Gigabit Ethernet Supplier Device Package: 64-QFN (8x8) Receiver Hysteresis: 500 mV Duplex: Full, Half Part Status: Active |
auf Bestellung 1992 Stücke: Lieferzeit 10-14 Tag (e) |
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ATSAME54N20A-AUT-EFP |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATSAMD51J18A-MUT-EFP |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MIC33M656-FAYMP-TR |
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Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 8.94 EUR |
25+ | 7.46 EUR |
100+ | 7.23 EUR |
ATSAME51J18A-AUT-EFP |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SAM9X60T-V/DWB |
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Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
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1500+ | 6.84 EUR |
SAM9X60-V/DWB |
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Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Tray
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Tray
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 1142 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 8.11 EUR |
25+ | 7.44 EUR |
100+ | 6.73 EUR |
SAM9X60T-V/DWB |
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Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Cut Tape (CT)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Cut Tape (CT)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 3112 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 8.24 EUR |
25+ | 7.55 EUR |
100+ | 6.84 EUR |
DSC1221NI2-125M0000 |
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Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
DSC1222NI2-156M2500 |
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Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
DSC1221CL2-25M00000 |
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Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
DSC1221DA2-25M00000 |
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Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
DSC1222NI2-150M0000 |
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Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
DSC1222DI2-156M2500 |
![]() |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
DSC1223DI2-150M0000 |
![]() |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MRF89XAM9AT-I/RM |
![]() |
Hersteller: Microchip Technology
Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
500+ | 13.00 EUR |
DSC1222CI2-25M00000 |
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Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
DSC1223DI2-212M5000 |
![]() |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Description: OSC MEMS SMD HIGH PERFORMANCE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
DSC1222CI2-212M5000 |
![]() |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Description: OSC MEMS SMD HIGH PERFORMANCE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
DSC1223BI2-156M2500 |
![]() |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
DSC1223CI2-133M3333 |
![]() |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
DSC1224DI2-125M0000 |
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Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
DSC1224DL1-100M0000 |
![]() |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MRF89XAM9AT-I/RM |
![]() |
Hersteller: Microchip Technology
Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Cut Tape (CT)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Cut Tape (CT)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 5582 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 12.99 EUR |
SAM9X60D5M-I/4FB |
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Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 130 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.24 EUR |
25+ | 13.54 EUR |
100+ | 13.08 EUR |
SAM9X60D5MT-I/4FB |
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Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SAM9X60D1G-I/4FB |
![]() |
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 303 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 17.48 EUR |
25+ | 14.56 EUR |
100+ | 14.06 EUR |
SAM9X60D1GT-I/4FB |
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Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SAM9X60D5MT-I/4FB |
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Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Cut Tape (CT)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Cut Tape (CT)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SAM9X60D1GT-I/4FB |
![]() |
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Cut Tape (CT)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Cut Tape (CT)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATSAMA5D27C-D1G-CUR |
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Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 289TFBGA
Packaging: Cut Tape (CT)
Package / Case: 289-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-TFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
Description: IC MPU SAMA5D2 500MHZ 289TFBGA
Packaging: Cut Tape (CT)
Package / Case: 289-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-TFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
auf Bestellung 1911 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 28.88 EUR |
25+ | 24.08 EUR |
100+ | 23.25 EUR |
ATECC608A-TNGTLSU-B |
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROTO 8-UDFN
Description: TRUST & GO TLS I2C PROTO 8-UDFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATECC608A-TNGLORAS-G |
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATECC608A-TNGTLSS-C |
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATECC608A-TNGLORAU-C |
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATECC608A-TNGLORAU-G |
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATECC608A-TNGTLSU-C |
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATECC608A-TNGLORAS-C |
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATECC608A-TNGTLSS-B |
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROTO 8-SOIC
Description: TRUST & GO TLS I2C PROTO 8-SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATECC608A-TNGTLSS-G |
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATECC608A-TNGLORAS-B |
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROTO 8-S
Description: TRUST & GO LORAWAN I2C PROTO 8-S
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
ATECC608A-TNGTLSU-G |
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATECC608A-TNGLORAU-B |
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROTO 8-U
Description: TRUST & GO LORAWAN I2C PROTO 8-U
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
KSZ9131MNXC-TR |
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Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1000+ | 4.92 EUR |
DT100108 |
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Hersteller: Microchip Technology
Description: EVAL BOARD FOR MIC33M656
Packaging: Bulk
Voltage - Output: 0.6V, 3.84V
Voltage - Input: 2.4V ~ 5.5V
Current - Output: 6A
Contents: Board(s)
Frequency - Switching: 2.2MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MIC33M656
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Description: EVAL BOARD FOR MIC33M656
Packaging: Bulk
Voltage - Output: 0.6V, 3.84V
Voltage - Input: 2.4V ~ 5.5V
Current - Output: 6A
Contents: Board(s)
Frequency - Switching: 2.2MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MIC33M656
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
RN4870-I/RM140 |
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Hersteller: Microchip Technology
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4870
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4870
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 761 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 15.00 EUR |
25+ | 13.72 EUR |
KSZ9131RNXC-TR |
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Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1000+ | 4.45 EUR |
KSZ9131MNXI |
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Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 7.62 EUR |
25+ | 6.32 EUR |
KSZ9131MNXI-TR |
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Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Description: IC TXRX FULL/HALF 8/8 64QFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
KSZ9131MNXC |
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Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 201 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.09 EUR |
25+ | 5.07 EUR |
100+ | 4.92 EUR |
RN4871-V/RM140 |
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Hersteller: Microchip Technology
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4871
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4871
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 349 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 15.00 EUR |
25+ | 13.72 EUR |
KSZ9131RNXI-TR |
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Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1000+ | 5.55 EUR |
DT100107 |
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Hersteller: Microchip Technology
Description: MIC33M650 6A STEP DOWN MODULE EV
Packaging: Bulk
Voltage - Output: 0.6V, 0.8V, 0.9V, 1V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Voltage - Input: 2.4V ~ 5.5V
Current - Output: 6A
Contents: Board(s)
Frequency - Switching: 2MHz
Regulator Topology: Buck
Board Type: Fully Populated
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 9 Non-Isolated Outputs
Part Status: Active
Description: MIC33M650 6A STEP DOWN MODULE EV
Packaging: Bulk
Voltage - Output: 0.6V, 0.8V, 0.9V, 1V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Voltage - Input: 2.4V ~ 5.5V
Current - Output: 6A
Contents: Board(s)
Frequency - Switching: 2MHz
Regulator Topology: Buck
Board Type: Fully Populated
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 9 Non-Isolated Outputs
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
RN4870-V/RM140 |
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Hersteller: Microchip Technology
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4870
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4870
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 10082 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 15.00 EUR |
25+ | 13.72 EUR |
KSZ9131RNXC |
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Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
auf Bestellung 307 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.54 EUR |
25+ | 4.61 EUR |
100+ | 4.45 EUR |
BM64SPKS1MC2-0002AA |
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Hersteller: Microchip Technology
Description: RF TXRX MODULE BT TRC ANT SMD
Description: RF TXRX MODULE BT TRC ANT SMD
auf Bestellung 1455 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 24.55 EUR |
KSZ9131RNXI |
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Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
auf Bestellung 422 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.92 EUR |
25+ | 5.77 EUR |
100+ | 5.55 EUR |
RN4871-I/RM140 |
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Hersteller: Microchip Technology
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4871
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4871
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2280 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 15.00 EUR |
25+ | 13.72 EUR |
KSZ9131MNXI-TR |
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Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Description: IC TXRX FULL/HALF 8/8 64QFN
auf Bestellung 736 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
KSZ9131RNXC-TR |
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Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 1924 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.54 EUR |
25+ | 4.61 EUR |
100+ | 4.45 EUR |
KSZ9131MNXC-TR |
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Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 1992 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.09 EUR |
25+ | 5.07 EUR |
100+ | 4.92 EUR |