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DSC1223DI2-212M5000 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
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DSC1222CI2-212M5000 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
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DSC1223BI2-156M2500 DSC1223BI2-156M2500 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSC1223CI2-133M3333 DSC1223CI2-133M3333 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
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DSC1224DI2-125M0000 DSC1224DI2-125M0000 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1224DL1-100M0000 DSC1224DL1-100M0000 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
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MRF89XAM9AT-I/RM MRF89XAM9AT-I/RM Microchip Technology 75017B.pdf Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Cut Tape (CT)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
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SAM9X60D5M-I/4FB SAM9X60D5M-I/4FB Microchip Technology SAM9X60-SIP-DataSheet-DS60001580B.pdf Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
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SAM9X60D5MT-I/4FB SAM9X60D5MT-I/4FB Microchip Technology SAM9X60-SIP-DataSheet-DS60001580B.pdf Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
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SAM9X60D1G-I/4FB SAM9X60D1G-I/4FB Microchip Technology SAM9X60-SIP-DataSheet-DS60001580B.pdf Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
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SAM9X60D1GT-I/4FB SAM9X60D1GT-I/4FB Microchip Technology SAM9X60-SIP-DataSheet-DS60001580B.pdf Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
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SAM9X60D5MT-I/4FB SAM9X60D5MT-I/4FB Microchip Technology SAM9X60-SIP-DataSheet-DS60001580B.pdf Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Cut Tape (CT)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
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SAM9X60D1GT-I/4FB SAM9X60D1GT-I/4FB Microchip Technology SAM9X60-SIP-DataSheet-DS60001580B.pdf Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Cut Tape (CT)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
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ATSAMA5D27C-D1G-CUR ATSAMA5D27C-D1G-CUR Microchip Technology SAMA5D2-Plus-DDR2-LPDDR2-System-in-Package-(SIP)-60001484d.pdf Description: IC MPU SAMA5D2 500MHZ 289TFBGA
Packaging: Cut Tape (CT)
Package / Case: 289-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-TFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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ATECC608A-TNGTLSU-B Microchip Technology Description: TRUST & GO TLS I2C PROTO 8-UDFN
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ATECC608A-TNGLORAS-G Microchip Technology Description: TRUST & GO LORAWAN I2C PROVISION
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ATECC608A-TNGTLSS-C Microchip Technology Description: TRUST & GO TLS I2C PROVISIONED 8
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ATECC608A-TNGLORAU-C Microchip Technology Description: TRUST & GO LORAWAN I2C PROVISION
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ATECC608A-TNGLORAU-G Microchip Technology Description: TRUST & GO LORAWAN I2C PROVISION
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ATECC608A-TNGTLSU-C Microchip Technology Description: TRUST & GO TLS I2C PROVISIONED 8
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ATECC608A-TNGLORAS-C Microchip Technology Description: TRUST & GO LORAWAN I2C PROVISION
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ATECC608A-TNGTLSS-B Microchip Technology Description: TRUST & GO TLS I2C PROTO 8-SOIC
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ATECC608A-TNGTLSS-G Microchip Technology Description: TRUST & GO TLS I2C PROVISIONED 8
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ATECC608A-TNGLORAS-B Microchip Technology Description: TRUST & GO LORAWAN I2C PROTO 8-S
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ATECC608A-TNGTLSU-G Microchip Technology Description: TRUST & GO TLS I2C PROVISIONED 8
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ATECC608A-TNGLORAU-B Microchip Technology Description: TRUST & GO LORAWAN I2C PROTO 8-U
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KSZ9131MNXC-TR KSZ9131MNXC-TR Microchip Technology 00002840B.pdf Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
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DT100108 DT100108 Microchip Technology DT100108_Web.pdf Description: EVAL BOARD FOR MIC33M656
Packaging: Bulk
Voltage - Output: 0.6V, 3.84V
Voltage - Input: 2.4V ~ 5.5V
Current - Output: 6A
Contents: Board(s)
Frequency - Switching: 2.2MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MIC33M656
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
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RN4870-I/RM140 RN4870-I/RM140 Microchip Technology RN4870-71-Bluetooth-Low-Energy-Module-DS50002489.pdf Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4870
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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KSZ9131RNXC-TR KSZ9131RNXC-TR Microchip Technology 00002841B.pdf Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
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KSZ9131MNXI KSZ9131MNXI Microchip Technology 00002840B.pdf Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
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KSZ9131MNXI-TR KSZ9131MNXI-TR Microchip Technology 00002840B.pdf Description: IC TXRX FULL/HALF 8/8 64QFN
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KSZ9131MNXC KSZ9131MNXC Microchip Technology 00002840B.pdf Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
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3+6.09 EUR
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RN4871-V/RM140 RN4871-V/RM140 Microchip Technology RN4870-71-Bluetooth-Low-Energy-Module-DS50002489.pdf Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4871
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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KSZ9131RNXI-TR KSZ9131RNXI-TR Microchip Technology 00002841B.pdf Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
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1000+5.82 EUR
Mindestbestellmenge: 1000
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DT100107 DT100107 Microchip Technology DT100107_Web.pdf Description: MIC33M650 6A STEP DOWN MODULE EV
Packaging: Bulk
Voltage - Output: 0.6V, 0.8V, 0.9V, 1V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Voltage - Input: 2.4V ~ 5.5V
Current - Output: 6A
Contents: Board(s)
Frequency - Switching: 2MHz
Regulator Topology: Buck
Board Type: Fully Populated
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 9 Non-Isolated Outputs
Part Status: Active
Produkt ist nicht verfügbar
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RN4870-V/RM140 RN4870-V/RM140 Microchip Technology RN4870-71-Bluetooth-Low-Energy-Module-DS50002489.pdf Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4870
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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2+15.00 EUR
25+13.72 EUR
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KSZ9131RNXC KSZ9131RNXC Microchip Technology 00002841B.pdf Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
auf Bestellung 106 Stücke:
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4+5.67 EUR
25+4.71 EUR
100+4.54 EUR
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BM64SPKS1MC2-0002AA BM64SPKS1MC2-0002AA Microchip Technology BM62-BM64-Data-Sheet-60001403F.pdf Description: RF TXRX MODULE BT TRC ANT SMD
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KSZ9131RNXI KSZ9131RNXI Microchip Technology 00002841B.pdf Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
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RN4871-I/RM140 RN4871-I/RM140 Microchip Technology RN4870-71-Bluetooth-Low-Energy-Module-DS50002489.pdf Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4871
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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KSZ9131MNXI-TR KSZ9131MNXI-TR Microchip Technology 00002840B.pdf Description: IC TXRX FULL/HALF 8/8 64QFN
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KSZ9131RNXC-TR KSZ9131RNXC-TR Microchip Technology 00002841B.pdf Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
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KSZ9131MNXC-TR KSZ9131MNXC-TR Microchip Technology 00002840B.pdf Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
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KSZ9131RNXI-TR KSZ9131RNXI-TR Microchip Technology 00002841B.pdf Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
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DSA6021JA2B-01ARVAO DSA6021JA2B-01ARVAO Microchip Technology DSA60xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006221A.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.89mm)
Current - Supply (Max): 1.3mA (Typ)
Frequency - Output 1: 80MHz
Part Status: Active
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA6021JA2B-01ARTVAO DSA6021JA2B-01ARTVAO Microchip Technology DSA60xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006221A.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.89mm)
Current - Supply (Max): 1.3mA (Typ)
Frequency - Output 1: 80MHz
Part Status: Active
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MCP6C02T-020H/Q8BVAO MCP6C02T-020H/Q8BVAO Microchip Technology Zero-Drift-65V-High-Side-Current-Sense-Amplifier-DS20006129C.pdf Description: IC CURRENT SENSE 1 CIRCUIT 8VDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Amplifier Type: Current Sense
Operating Temperature: -40°C ~ 150°C (TA)
Current - Supply: 490µA
Gain Bandwidth Product: 500 kHz
Current - Input Bias: 170 µA
Voltage - Input Offset: 1.9 µV
Supplier Device Package: 8-VDFN (3x3)
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
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DSC6001CA3B-PROG Microchip Technology Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Produkt ist nicht verfügbar
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MCP6C02T-100E/CHYVAO MCP6C02T-100E/CHYVAO Microchip Technology Zero-Drift-65V-High-Side-Current-Sense-Amplifier-DS20006129C.pdf Description: IC CURR SENSE 1 CIRCUIT SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Amplifier Type: Current Sense
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 490µA
Gain Bandwidth Product: 500 kHz
Current - Input Bias: 170 µA
Voltage - Input Offset: 1.5 µV
Supplier Device Package: SOT-23-6
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
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MCP6C02T-050H/Q8BVAO MCP6C02T-050H/Q8BVAO Microchip Technology Zero-Drift-65V-High-Side-Current-Sense-Amplifier-DS20006129C.pdf Description: IC CURRENT SENSE 1 CIRCUIT 8VDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Amplifier Type: Current Sense
Operating Temperature: -40°C ~ 150°C (TA)
Current - Supply: 490µA
Gain Bandwidth Product: 500 kHz
Current - Input Bias: 170 µA
Voltage - Input Offset: 1.65 µV
Supplier Device Package: 8-VDFN (3x3)
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
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MCP6C02T-020E/CHYVAO MCP6C02T-020E/CHYVAO Microchip Technology Zero-Drift-65V-High-Side-Current-Sense-Amplifier-DS20006129C.pdf Description: IC CURR SENSE 1 CIRCUIT SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Amplifier Type: Current Sense
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 490µA
Gain Bandwidth Product: 500 kHz
Current - Input Bias: 170 µA
Voltage - Input Offset: 1.9 µV
Supplier Device Package: SOT-23-6
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
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DSC6003CA3B-PROG DSC6003CA3B-PROG Microchip Technology Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Available Frequency Range: 2 kHz ~ 80 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MCP6C02T-050E/CHYVAO MCP6C02T-050E/CHYVAO Microchip Technology Zero-Drift-65V-High-Side-Current-Sense-Amplifier-DS20006129C.pdf Description: IC CURR SENSE 1 CIRCUIT SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Amplifier Type: Current Sense
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 490µA
Gain Bandwidth Product: 500 kHz
Current - Input Bias: 170 µA
Voltage - Input Offset: 1.65 µV
Supplier Device Package: SOT-23-6
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
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MCP6C02T-100H/Q8BVAO MCP6C02T-100H/Q8BVAO Microchip Technology Zero-Drift-65V-High-Side-Current-Sense-Amplifier-DS20006129C.pdf Description: IC CURRENT SENSE 1 CIRCUIT 8VDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Amplifier Type: Current Sense
Operating Temperature: -40°C ~ 150°C (TA)
Current - Supply: 490µA
Gain Bandwidth Product: 500 kHz
Current - Input Bias: 170 µA
Voltage - Input Offset: 1.5 µV
Supplier Device Package: 8-VDFN (3x3)
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
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DSA6121MA1B-01AETVAO DSA6121MA1B-01AETVAO Microchip Technology Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.89mm)
Current - Supply (Max): 3mA (Typ)
Frequency - Output 1: 100MHz
Part Status: Active
Base Resonator: MEMS
Produkt ist nicht verfügbar
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PD-9501GR/AC-EU PD-9501GR/AC-EU Microchip Technology 136301-pd-9501gr-ac-datasheet Description: 1-PORT AT 60W AC EU CORD
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1+227.87 EUR
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PD-9501GR/AC-AU Microchip Technology 136301-pd-9501gr-ac-datasheet Description: 1-PORT AT 60W AC AU CORD
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PD-9501GR/AC-JP PD-9501GR/AC-JP Microchip Technology 136301-pd-9501gr-ac-datasheet Description: 1-PORT AT 60W AC JP CORD
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PD-9501GR/AC-UK Microchip Technology 136301-pd-9501gr-ac-datasheet Description: 1-PORT AT 60W AC UK CORD
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DSC1223DI2-212M5000 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
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DSC1222CI2-212M5000 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Produkt ist nicht verfügbar
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DSC1223BI2-156M2500 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1223BI2-156M2500
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1223CI2-133M3333 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1223CI2-133M3333
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1224DI2-125M0000 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1224DI2-125M0000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1224DL1-100M0000 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1224DL1-100M0000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MRF89XAM9AT-I/RM 75017B.pdf
MRF89XAM9AT-I/RM
Hersteller: Microchip Technology
Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Cut Tape (CT)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 5582 Stücke:
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Anzahl Preis
2+12.99 EUR
Mindestbestellmenge: 2
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SAM9X60D5M-I/4FB SAM9X60-SIP-DataSheet-DS60001580B.pdf
SAM9X60D5M-I/4FB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 130 Stücke:
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Anzahl Preis
2+16.24 EUR
25+13.54 EUR
100+13.08 EUR
Mindestbestellmenge: 2
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SAM9X60D5MT-I/4FB SAM9X60-SIP-DataSheet-DS60001580B.pdf
SAM9X60D5MT-I/4FB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
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SAM9X60D1G-I/4FB SAM9X60-SIP-DataSheet-DS60001580B.pdf
SAM9X60D1G-I/4FB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 303 Stücke:
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Anzahl Preis
2+17.48 EUR
25+14.56 EUR
100+14.06 EUR
Mindestbestellmenge: 2
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SAM9X60D1GT-I/4FB SAM9X60-SIP-DataSheet-DS60001580B.pdf
SAM9X60D1GT-I/4FB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
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SAM9X60D5MT-I/4FB SAM9X60-SIP-DataSheet-DS60001580B.pdf
SAM9X60D5MT-I/4FB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Cut Tape (CT)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
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SAM9X60D1GT-I/4FB SAM9X60-SIP-DataSheet-DS60001580B.pdf
SAM9X60D1GT-I/4FB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Cut Tape (CT)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
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ATSAMA5D27C-D1G-CUR SAMA5D2-Plus-DDR2-LPDDR2-System-in-Package-(SIP)-60001484d.pdf
ATSAMA5D27C-D1G-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 289TFBGA
Packaging: Cut Tape (CT)
Package / Case: 289-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-TFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
auf Bestellung 2111 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+28.88 EUR
25+24.08 EUR
100+23.25 EUR
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ATECC608A-TNGTLSU-B
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROTO 8-UDFN
Produkt ist nicht verfügbar
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ATECC608A-TNGLORAS-G
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
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ATECC608A-TNGTLSS-C
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
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ATECC608A-TNGLORAU-C
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
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ATECC608A-TNGLORAU-G
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
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ATECC608A-TNGTLSU-C
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
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ATECC608A-TNGLORAS-C
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
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ATECC608A-TNGTLSS-B
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROTO 8-SOIC
Produkt ist nicht verfügbar
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ATECC608A-TNGTLSS-G
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
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ATECC608A-TNGLORAS-B
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROTO 8-S
auf Bestellung 5 Stücke:
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ATECC608A-TNGTLSU-G
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
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ATECC608A-TNGLORAU-B
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROTO 8-U
Produkt ist nicht verfügbar
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KSZ9131MNXC-TR 00002840B.pdf
KSZ9131MNXC-TR
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+4.92 EUR
Mindestbestellmenge: 1000
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DT100108 DT100108_Web.pdf
DT100108
Hersteller: Microchip Technology
Description: EVAL BOARD FOR MIC33M656
Packaging: Bulk
Voltage - Output: 0.6V, 3.84V
Voltage - Input: 2.4V ~ 5.5V
Current - Output: 6A
Contents: Board(s)
Frequency - Switching: 2.2MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MIC33M656
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Produkt ist nicht verfügbar
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RN4870-I/RM140 RN4870-71-Bluetooth-Low-Energy-Module-DS50002489.pdf
RN4870-I/RM140
Hersteller: Microchip Technology
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4870
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 761 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.00 EUR
25+13.72 EUR
Mindestbestellmenge: 2
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KSZ9131RNXC-TR 00002841B.pdf
KSZ9131RNXC-TR
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+4.67 EUR
Mindestbestellmenge: 1000
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KSZ9131MNXI 00002840B.pdf
KSZ9131MNXI
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.62 EUR
25+6.32 EUR
Mindestbestellmenge: 3
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KSZ9131MNXI-TR 00002840B.pdf
KSZ9131MNXI-TR
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Produkt ist nicht verfügbar
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KSZ9131MNXC 00002840B.pdf
KSZ9131MNXC
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 201 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.09 EUR
25+5.07 EUR
100+4.92 EUR
Mindestbestellmenge: 3
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RN4871-V/RM140 RN4870-71-Bluetooth-Low-Energy-Module-DS50002489.pdf
RN4871-V/RM140
Hersteller: Microchip Technology
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4871
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 349 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.00 EUR
25+13.72 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
KSZ9131RNXI-TR 00002841B.pdf
KSZ9131RNXI-TR
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+5.82 EUR
Mindestbestellmenge: 1000
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DT100107 DT100107_Web.pdf
DT100107
Hersteller: Microchip Technology
Description: MIC33M650 6A STEP DOWN MODULE EV
Packaging: Bulk
Voltage - Output: 0.6V, 0.8V, 0.9V, 1V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Voltage - Input: 2.4V ~ 5.5V
Current - Output: 6A
Contents: Board(s)
Frequency - Switching: 2MHz
Regulator Topology: Buck
Board Type: Fully Populated
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 9 Non-Isolated Outputs
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
RN4870-V/RM140 RN4870-71-Bluetooth-Low-Energy-Module-DS50002489.pdf
RN4870-V/RM140
Hersteller: Microchip Technology
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4870
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 10082 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.00 EUR
25+13.72 EUR
Mindestbestellmenge: 2
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KSZ9131RNXC 00002841B.pdf
KSZ9131RNXC
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
auf Bestellung 106 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.67 EUR
25+4.71 EUR
100+4.54 EUR
Mindestbestellmenge: 4
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BM64SPKS1MC2-0002AA BM62-BM64-Data-Sheet-60001403F.pdf
BM64SPKS1MC2-0002AA
Hersteller: Microchip Technology
Description: RF TXRX MODULE BT TRC ANT SMD
auf Bestellung 1455 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.55 EUR
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KSZ9131RNXI 00002841B.pdf
KSZ9131RNXI
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
auf Bestellung 1309 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.25 EUR
25+6.06 EUR
100+5.82 EUR
Mindestbestellmenge: 3
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RN4871-I/RM140 RN4870-71-Bluetooth-Low-Energy-Module-DS50002489.pdf
RN4871-I/RM140
Hersteller: Microchip Technology
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4871
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2280 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.00 EUR
25+13.72 EUR
Mindestbestellmenge: 2
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KSZ9131MNXI-TR 00002840B.pdf
KSZ9131MNXI-TR
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
auf Bestellung 736 Stücke:
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KSZ9131RNXC-TR 00002841B.pdf
KSZ9131RNXC-TR
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 2235 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.81 EUR
25+4.84 EUR
100+4.67 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
KSZ9131MNXC-TR 00002840B.pdf
KSZ9131MNXC-TR
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 1992 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.09 EUR
25+5.07 EUR
100+4.92 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
KSZ9131RNXI-TR 00002841B.pdf
KSZ9131RNXI-TR
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
auf Bestellung 2561 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.25 EUR
25+6.06 EUR
100+5.82 EUR
Mindestbestellmenge: 3
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DSA6021JA2B-01ARVAO DSA60xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006221A.pdf
DSA6021JA2B-01ARVAO
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.89mm)
Current - Supply (Max): 1.3mA (Typ)
Frequency - Output 1: 80MHz
Part Status: Active
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA6021JA2B-01ARTVAO DSA60xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006221A.pdf
DSA6021JA2B-01ARTVAO
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.89mm)
Current - Supply (Max): 1.3mA (Typ)
Frequency - Output 1: 80MHz
Part Status: Active
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MCP6C02T-020H/Q8BVAO Zero-Drift-65V-High-Side-Current-Sense-Amplifier-DS20006129C.pdf
MCP6C02T-020H/Q8BVAO
Hersteller: Microchip Technology
Description: IC CURRENT SENSE 1 CIRCUIT 8VDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Amplifier Type: Current Sense
Operating Temperature: -40°C ~ 150°C (TA)
Current - Supply: 490µA
Gain Bandwidth Product: 500 kHz
Current - Input Bias: 170 µA
Voltage - Input Offset: 1.9 µV
Supplier Device Package: 8-VDFN (3x3)
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
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DSC6001CA3B-PROG
Hersteller: Microchip Technology
Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Produkt ist nicht verfügbar
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MCP6C02T-100E/CHYVAO Zero-Drift-65V-High-Side-Current-Sense-Amplifier-DS20006129C.pdf
MCP6C02T-100E/CHYVAO
Hersteller: Microchip Technology
Description: IC CURR SENSE 1 CIRCUIT SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Amplifier Type: Current Sense
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 490µA
Gain Bandwidth Product: 500 kHz
Current - Input Bias: 170 µA
Voltage - Input Offset: 1.5 µV
Supplier Device Package: SOT-23-6
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
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MCP6C02T-050H/Q8BVAO Zero-Drift-65V-High-Side-Current-Sense-Amplifier-DS20006129C.pdf
MCP6C02T-050H/Q8BVAO
Hersteller: Microchip Technology
Description: IC CURRENT SENSE 1 CIRCUIT 8VDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Amplifier Type: Current Sense
Operating Temperature: -40°C ~ 150°C (TA)
Current - Supply: 490µA
Gain Bandwidth Product: 500 kHz
Current - Input Bias: 170 µA
Voltage - Input Offset: 1.65 µV
Supplier Device Package: 8-VDFN (3x3)
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
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MCP6C02T-020E/CHYVAO Zero-Drift-65V-High-Side-Current-Sense-Amplifier-DS20006129C.pdf
MCP6C02T-020E/CHYVAO
Hersteller: Microchip Technology
Description: IC CURR SENSE 1 CIRCUIT SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Amplifier Type: Current Sense
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 490µA
Gain Bandwidth Product: 500 kHz
Current - Input Bias: 170 µA
Voltage - Input Offset: 1.9 µV
Supplier Device Package: SOT-23-6
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
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DSC6003CA3B-PROG
DSC6003CA3B-PROG
Hersteller: Microchip Technology
Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Available Frequency Range: 2 kHz ~ 80 MHz
Base Resonator: MEMS
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MCP6C02T-050E/CHYVAO Zero-Drift-65V-High-Side-Current-Sense-Amplifier-DS20006129C.pdf
MCP6C02T-050E/CHYVAO
Hersteller: Microchip Technology
Description: IC CURR SENSE 1 CIRCUIT SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Amplifier Type: Current Sense
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 490µA
Gain Bandwidth Product: 500 kHz
Current - Input Bias: 170 µA
Voltage - Input Offset: 1.65 µV
Supplier Device Package: SOT-23-6
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
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MCP6C02T-100H/Q8BVAO Zero-Drift-65V-High-Side-Current-Sense-Amplifier-DS20006129C.pdf
MCP6C02T-100H/Q8BVAO
Hersteller: Microchip Technology
Description: IC CURRENT SENSE 1 CIRCUIT 8VDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Amplifier Type: Current Sense
Operating Temperature: -40°C ~ 150°C (TA)
Current - Supply: 490µA
Gain Bandwidth Product: 500 kHz
Current - Input Bias: 170 µA
Voltage - Input Offset: 1.5 µV
Supplier Device Package: 8-VDFN (3x3)
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
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DSA6121MA1B-01AETVAO
DSA6121MA1B-01AETVAO
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.89mm)
Current - Supply (Max): 3mA (Typ)
Frequency - Output 1: 100MHz
Part Status: Active
Base Resonator: MEMS
Produkt ist nicht verfügbar
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PD-9501GR/AC-EU 136301-pd-9501gr-ac-datasheet
PD-9501GR/AC-EU
Hersteller: Microchip Technology
Description: 1-PORT AT 60W AC EU CORD
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+227.87 EUR
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PD-9501GR/AC-AU 136301-pd-9501gr-ac-datasheet
Hersteller: Microchip Technology
Description: 1-PORT AT 60W AC AU CORD
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PD-9501GR/AC-JP 136301-pd-9501gr-ac-datasheet
PD-9501GR/AC-JP
Hersteller: Microchip Technology
Description: 1-PORT AT 60W AC JP CORD
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+205.36 EUR
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PD-9501GR/AC-UK 136301-pd-9501gr-ac-datasheet
Hersteller: Microchip Technology
Description: 1-PORT AT 60W AC UK CORD
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