Produkte > MILL-MAX MANUFACTURING CORP. > Alle Produkte des Herstellers MILL-MAX MANUFACTURING CORP. (38205) > Seite 196 nach 637
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| 117-41-620-41-105000 | Mill-Max Manufacturing Corp. |
 Description: CONN IC SKT DBLPackaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 117-41-628-41-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 117-41-628-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 117-41-640-41-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-41-640-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
||
| 117-41-642-41-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||
| 117-41-642-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 117-41-648-41-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
||
| 117-41-648-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-41-652-41-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 52 (2 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
||
| 117-41-652-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 52 (2 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
||
| 117-41-656-41-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 56 (2 x 28) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
||
| 117-41-656-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 56 (2 x 28) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
||
| 117-41-664-41-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
||
| 117-41-664-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
||
| 117-41-668-41-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
||
| 117-41-668-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
||
| 117-43-316-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 117-43-316-61-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 117-43-316-61-105000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-43-430-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-43-448-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 117-43-448-61-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||
| 117-43-448-61-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 117-43-620-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
||
| 117-43-620-61-005000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
||
| 117-43-620-61-105000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
||
| 117-43-628-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
||
| 117-43-628-61-005000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
||
| 117-43-628-61-105000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
||
| 117-43-640-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 117-43-640-61-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||
| 117-43-640-61-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||
| 117-43-642-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||
| 117-43-642-61-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 117-43-642-61-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||
| 117-43-648-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 117-43-648-61-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||
| 117-43-648-61-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 117-43-652-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-43-652-61-005000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-43-656-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-43-656-61-005000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-43-656-61-105000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-43-664-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-43-664-61-005000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-43-668-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-43-668-61-005000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-47-316-41-005000 | Mill-Max Manufacturing Corp. |
Description: STANDRD SOLDRTL |
Produkt ist nicht verfügbar |
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| 117-47-448-41-005000 | Mill-Max Manufacturing Corp. |
Description: STANDRD SOLDRTL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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| 117-47-668-41-005000 | Mill-Max Manufacturing Corp. |
Description: STANDRD SOLDRTL |
Produkt ist nicht verfügbar |
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| 117-91-428-41-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 117-91-642-41-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 117-91-648-41-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
||
| 117-91-664-41-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
||
| 117-91-668-41-005000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 68 (2 x 34) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
||
| 117-93-642-61-005000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
||
| 1210-0-05-80-00-00-01-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN SQUARE Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Terminal Type: PC Pin Flange Diameter: 0.062" (1.57mm) Length - Overall: 0.380" (9.65mm) Termination: Press-Fit, Knurled, Wire Wrap Mounting Hole Diameter: 0.053" (1.35mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Terminal Style: Single End Pin Size - Above Flange: 0.025" (0.64mm) Square Length - Above Flange: 0.349" (8.86mm) Part Status: Active |
Produkt ist nicht verfügbar |
||
| 121-11-304-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||
| 121-11-316-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
| 117-41-620-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-41-628-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-41-628-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-41-640-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-41-640-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-41-642-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-41-642-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-41-648-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-41-648-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-41-652-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 117-41-652-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 117-41-656-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 117-41-656-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 117-41-664-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 117-41-664-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 117-41-668-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-41-668-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-316-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-316-61-005000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-316-61-105000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-430-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-448-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-448-61-005000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-448-61-105000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-620-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-620-61-005000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-620-61-105000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-628-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-628-61-005000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-628-61-105000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-640-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-640-61-005000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-640-61-105000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-642-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-642-61-005000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-642-61-105000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-648-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-648-61-005000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-648-61-105000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-43-652-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-652-61-005000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-656-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-656-61-005000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-656-61-105000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-664-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-664-61-005000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-668-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-43-668-61-005000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-47-316-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDRTL
Description: STANDRD SOLDRTL
Produkt ist nicht verfügbar
| 117-47-448-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDRTL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: STANDRD SOLDRTL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 117-47-668-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDRTL
Description: STANDRD SOLDRTL
Produkt ist nicht verfügbar
| 117-91-428-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-91-642-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 117-91-648-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 117-91-664-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 117-91-668-41-005000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (2 x 34)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (2 x 34)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 117-93-642-61-005000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 1210-0-05-80-00-00-01-0 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PC PIN SQUARE
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Terminal Type: PC Pin
Flange Diameter: 0.062" (1.57mm)
Length - Overall: 0.380" (9.65mm)
Termination: Press-Fit, Knurled, Wire Wrap
Mounting Hole Diameter: 0.053" (1.35mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.025" (0.64mm) Square
Length - Above Flange: 0.349" (8.86mm)
Part Status: Active
Description: CONN PC PIN SQUARE
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Terminal Type: PC Pin
Flange Diameter: 0.062" (1.57mm)
Length - Overall: 0.380" (9.65mm)
Termination: Press-Fit, Knurled, Wire Wrap
Mounting Hole Diameter: 0.053" (1.35mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.025" (0.64mm) Square
Length - Above Flange: 0.349" (8.86mm)
Part Status: Active
Produkt ist nicht verfügbar
| 121-11-304-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 121-11-316-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar