Suchergebnisse für "0091312" : 12
Art der Ansicht :
Mindestbestellmenge: 34
Mindestbestellmenge: 15
Mindestbestellmenge: 1000
Mindestbestellmenge: 11
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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4818-3000-CP | 3M Electronic Solutions Division | IC & Component Sockets 18P DUAL WIPE DIPSKT |
auf Bestellung 1477 Stücke: Lieferzeit 14-28 Tag (e) |
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4818-3000-CP | 3M |
Description: CONN IC DIP SOCKET 18POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 1373 Stücke: Lieferzeit 21-28 Tag (e) |
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ABM3B-32.000MHZ-B2-T | Abracon LLC |
Description: CRYSTAL 32.0000MHZ 18PF SMD Packaging: Tape & Reel (TR) Package / Case: 4-SMD, No Lead Load Capacitance: 18pF Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Type: MHz Crystal Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Frequency Tolerance: ±20ppm Operating Mode: Fundamental Height - Seated (Max): 0.043" (1.10mm) ESR (Equivalent Series Resistance): 50 Ohms Frequency: 32 MHz |
auf Bestellung 1000 Stücke: Lieferzeit 21-28 Tag (e) |
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ABM3B-32.000MHZ-B2-T | Abracon LLC |
Description: CRYSTAL 32.0000MHZ 18PF SMD Packaging: Cut Tape (CT) Package / Case: 4-SMD, No Lead Load Capacitance: 18pF Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Type: MHz Crystal Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Frequency Tolerance: ±20ppm Operating Mode: Fundamental Height - Seated (Max): 0.043" (1.10mm) ESR (Equivalent Series Resistance): 50 Ohms Frequency: 32 MHz |
auf Bestellung 1692 Stücke: Lieferzeit 21-28 Tag (e) |
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N10301 | APM HEXSEAL |
Description: APM HEXSEAL - N10301 - SWITCH BOOT tariffCode: 40169300 productTraceability: No rohsCompliant: YES euEccn: NLR hazardous: false rohsPhthalatesCompliant: TBA directShipCharge: 25 Zur Verwendung mit: Toggle Switches usEccn: EAR99 Produktpalette: - SVHC: Lead |
auf Bestellung 448 Stücke: Lieferzeit 14-21 Tag (e) |
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600913120 | Rose Enclosures |
Description: BOX PLASTIC 5.12"L X 3.7"W Features: Flame Retardant, PCB Supports, Watertight Packaging: Bulk Color: Gray, Clear Cover/Door Size / Dimension: 5.118" L x 3.701" W (130.00mm x 94.00mm) Material: Plastic, Polystyrene Thickness: 0.118" (3.00mm) Height: 2.244" (57.00mm) Design: Cover Included Ratings: IP66, NEMA 4,4X Container Type: Box Material Flammability Rating: UL94 HB Area (L x W): 18.9in² (122cm²) |
Produkt ist nicht verfügbar |
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ZPF000000000091312 | TE Connectivity | TE Connectivity |
Produkt ist nicht verfügbar |
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SIGC06T65EX1SA1 | Infineon Technologies | Trans IGBT Chip N-CH 650V 3-Pin Die Wafer |
Produkt ist nicht verfügbar |
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SIGC06T65GEX1SA1 | Infineon Technologies | IGBT3 Chip |
Produkt ist nicht verfügbar |
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SIGC08T65EX1SA1 | Infineon Technologies | Trans IGBT Chip N-CH 650V 3-Pin Die Wafer |
Produkt ist nicht verfügbar |
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SIGC10T65EX1SA1 | Infineon Technologies | Trans IGBT Chip N-CH 650V 3-Pin Die Wafer |
Produkt ist nicht verfügbar |
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SIGC15T65EX1SA1 | Infineon Technologies | Trans IGBT Chip N-CH 650V 3-Pin Die Wafer |
Produkt ist nicht verfügbar |
4818-3000-CP |
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 18P DUAL WIPE DIPSKT
IC & Component Sockets 18P DUAL WIPE DIPSKT
auf Bestellung 1477 Stücke:
Lieferzeit 14-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
34+ | 1.57 EUR |
42+ | 1.26 EUR |
100+ | 1.12 EUR |
500+ | 0.93 EUR |
4818-3000-CP |
Hersteller: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 1373 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
15+ | 1.85 EUR |
22+ | 1.56 EUR |
44+ | 1.47 EUR |
110+ | 1.4 EUR |
264+ | 1.28 EUR |
506+ | 1.15 EUR |
1012+ | 1.02 EUR |
ABM3B-32.000MHZ-B2-T |
Hersteller: Abracon LLC
Description: CRYSTAL 32.0000MHZ 18PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Load Capacitance: 18pF
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.043" (1.10mm)
ESR (Equivalent Series Resistance): 50 Ohms
Frequency: 32 MHz
Description: CRYSTAL 32.0000MHZ 18PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Load Capacitance: 18pF
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.043" (1.10mm)
ESR (Equivalent Series Resistance): 50 Ohms
Frequency: 32 MHz
auf Bestellung 1000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 1.45 EUR |
ABM3B-32.000MHZ-B2-T |
Hersteller: Abracon LLC
Description: CRYSTAL 32.0000MHZ 18PF SMD
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Load Capacitance: 18pF
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.043" (1.10mm)
ESR (Equivalent Series Resistance): 50 Ohms
Frequency: 32 MHz
Description: CRYSTAL 32.0000MHZ 18PF SMD
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Load Capacitance: 18pF
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.043" (1.10mm)
ESR (Equivalent Series Resistance): 50 Ohms
Frequency: 32 MHz
auf Bestellung 1692 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
11+ | 2.52 EUR |
12+ | 2.22 EUR |
50+ | 2.08 EUR |
100+ | 1.83 EUR |
500+ | 1.74 EUR |
N10301 |
Hersteller: APM HEXSEAL
Description: APM HEXSEAL - N10301 - SWITCH BOOT
tariffCode: 40169300
productTraceability: No
rohsCompliant: YES
euEccn: NLR
hazardous: false
rohsPhthalatesCompliant: TBA
directShipCharge: 25
Zur Verwendung mit: Toggle Switches
usEccn: EAR99
Produktpalette: -
SVHC: Lead
Description: APM HEXSEAL - N10301 - SWITCH BOOT
tariffCode: 40169300
productTraceability: No
rohsCompliant: YES
euEccn: NLR
hazardous: false
rohsPhthalatesCompliant: TBA
directShipCharge: 25
Zur Verwendung mit: Toggle Switches
usEccn: EAR99
Produktpalette: -
SVHC: Lead
auf Bestellung 448 Stücke:
Lieferzeit 14-21 Tag (e)600913120 |
Hersteller: Rose Enclosures
Description: BOX PLASTIC 5.12"L X 3.7"W
Features: Flame Retardant, PCB Supports, Watertight
Packaging: Bulk
Color: Gray, Clear Cover/Door
Size / Dimension: 5.118" L x 3.701" W (130.00mm x 94.00mm)
Material: Plastic, Polystyrene
Thickness: 0.118" (3.00mm)
Height: 2.244" (57.00mm)
Design: Cover Included
Ratings: IP66, NEMA 4,4X
Container Type: Box
Material Flammability Rating: UL94 HB
Area (L x W): 18.9in² (122cm²)
Description: BOX PLASTIC 5.12"L X 3.7"W
Features: Flame Retardant, PCB Supports, Watertight
Packaging: Bulk
Color: Gray, Clear Cover/Door
Size / Dimension: 5.118" L x 3.701" W (130.00mm x 94.00mm)
Material: Plastic, Polystyrene
Thickness: 0.118" (3.00mm)
Height: 2.244" (57.00mm)
Design: Cover Included
Ratings: IP66, NEMA 4,4X
Container Type: Box
Material Flammability Rating: UL94 HB
Area (L x W): 18.9in² (122cm²)
Produkt ist nicht verfügbar
SIGC06T65EX1SA1 |
Hersteller: Infineon Technologies
Trans IGBT Chip N-CH 650V 3-Pin Die Wafer
Trans IGBT Chip N-CH 650V 3-Pin Die Wafer
Produkt ist nicht verfügbar
SIGC08T65EX1SA1 |
Hersteller: Infineon Technologies
Trans IGBT Chip N-CH 650V 3-Pin Die Wafer
Trans IGBT Chip N-CH 650V 3-Pin Die Wafer
Produkt ist nicht verfügbar
SIGC10T65EX1SA1 |
Hersteller: Infineon Technologies
Trans IGBT Chip N-CH 650V 3-Pin Die Wafer
Trans IGBT Chip N-CH 650V 3-Pin Die Wafer
Produkt ist nicht verfügbar
SIGC15T65EX1SA1 |
Hersteller: Infineon Technologies
Trans IGBT Chip N-CH 650V 3-Pin Die Wafer
Trans IGBT Chip N-CH 650V 3-Pin Die Wafer
Produkt ist nicht verfügbar