08-2511-11 Aries Electronics
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 12.57 EUR |
| 10+ | 11.37 EUR |
| 25+ | 10.74 EUR |
| 50+ | 10.47 EUR |
| 100+ | 9.94 EUR |
| 250+ | 8.91 EUR |
| 500+ | 8.38 EUR |
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Technische Details 08-2511-11 Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.2" (5.08mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Phosphor Bronze.
Weitere Produktangebote 08-2511-11
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 08-2511-11 | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 8POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
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