auf Bestellung 166 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.8 EUR |
| 10+ | 2.45 EUR |
| 25+ | 2.32 EUR |
| 90+ | 2.18 EUR |
| 270+ | 1.66 EUR |
| 540+ | 1.61 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 08-3513-10 Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.
Weitere Produktangebote 08-3513-10
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 08-3513-10 | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 8POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |