09-0503-30 Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 12.19 EUR |
| 10+ | 10.42 EUR |
| 25+ | 10.09 EUR |
| 50+ | 8.16 EUR |
| 250+ | 7.81 EUR |
| 500+ | 7.52 EUR |
| 1000+ | 7.14 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 09-0503-30 Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA), Nylon, Glass Filled, Termination: Wire Wrap, Number of Positions or Pins (Grid): 9 (1 x 9), Type: SIP, Mounting Type: Through Hole, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm).
Weitere Produktangebote 09-0503-30
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
| 09-0503-30 | Aries Electronics |
 Description: CONN SOCKET SIP 9POS GOLDContact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA), Nylon, Glass Filled Termination: Wire Wrap Number of Positions or Pins (Grid): 9 (1 x 9) Type: SIP Mounting Type: Through Hole Packaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 123 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 09-0503-30 |
|
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 9 (1 x 9)
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Description: CONN SOCKET SIP 9POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 9 (1 x 9)
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Produkt ist nicht verfügbar
Mindestbestellmenge: 123 Stücke
Im Einkaufswagen
Stück im Wert von UAH