
10-2810-90 Aries Electronics

Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 867 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 18.41 EUR |
10+ | 14.14 EUR |
25+ | 12.77 EUR |
50+ | 11.85 EUR |
100+ | 11.01 EUR |
250+ | 10.03 EUR |
500+ | 9.36 EUR |
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Technische Details 10-2810-90 Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Right Angle, Vertical, Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 10 (2 x 5), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Weitere Produktangebote 10-2810-90
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10-2810-90 | Hersteller : Aries Electronics |
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