10-2810-90 Aries Electronics
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Packaging: Bulk
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.48 EUR |
| 10+ | 16.56 EUR |
| 25+ | 15.53 EUR |
| 50+ | 14.78 EUR |
| 100+ | 14.08 EUR |
| 250+ | 13.2 EUR |
| 500+ | 12.57 EUR |
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Technische Details 10-2810-90 Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD, Part Status: Active, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Solder, Number of Positions or Pins (Grid): 10 (2 x 5), Type: DIP, 0.2" (5.08mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Vertical, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 10-2810-90
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
10-2810-90 | Aries Electronics |
IC & Component Sockets 10P RT.ANG GLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 10-2810-90 |
|
Hersteller: Aries Electronics
IC & Component Sockets 10P RT.ANG GLD
IC & Component Sockets 10P RT.ANG GLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH