10-2810-90C Aries Electronics
auf Bestellung 51 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 13.71 EUR |
| 10+ | 12.34 EUR |
| 25+ | 11.33 EUR |
| 100+ | 11.04 EUR |
| 250+ | 9.84 EUR |
| 500+ | 8.59 EUR |
| 1000+ | 7.8 EUR |
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Technische Details 10-2810-90C Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Right Angle, Vertical, Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 10 (2 x 5), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 10-2810-90C nach Preis ab 10.71 EUR bis 14.12 EUR
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10-2810-90C | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 10POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 86 Stücke: Lieferzeit 10-14 Tag (e) |
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