10-2810-90C Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 16.76 EUR |
| 10+ | 14.22 EUR |
| 25+ | 13.32 EUR |
| 50+ | 12.7 EUR |
| 100+ | 12.09 EUR |
| 250+ | 11.33 EUR |
| 500+ | 10.78 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 10-2810-90C Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 10 (2 x 5), Type: DIP, 0.2" (5.08mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Vertical, Features: Closed Frame, Packaging: Bulk, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin.
Weitere Produktangebote 10-2810-90C nach Preis ab 12.74 EUR bis 16.8 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
10-2810-90C | Aries Electronics |
 Description: CONN IC DIP SOCKET 10POS GOLDPitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole, Right Angle, Vertical Features: Closed Frame Packaging: Bulk Part Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin |
auf Bestellung 86 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 10-2810-90C |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Description: CONN IC DIP SOCKET 10POS GOLD
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
auf Bestellung 86 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.8 EUR |
| 10+ | 14.28 EUR |
| 25+ | 13.39 EUR |
| 50+ | 12.74 EUR |