10AS027E4F29E3SG Intel
Hersteller: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 780-FBGA, FC (29x29)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 1.5GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 780-FBGA, FC (29x29)
Architecture: MCU, FPGA
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 2933.35 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 10AS027E4F29E3SG Intel
Description: IC SOC CORTEX-A9 1.5GHZ 780FBGA, Packaging: Tray, Package / Case: 780-BBGA, FCBGA, Speed: 1.5GHz, RAM Size: 256KB, Operating Temperature: 0°C ~ 100°C (TJ), Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, Primary Attributes: FPGA - 270K Logic Elements, Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, Peripherals: DMA, POR, WDT, Supplier Device Package: 780-FBGA, FC (29x29), Architecture: MCU, FPGA.
Weitere Produktangebote 10AS027E4F29E3SG
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
10AS027E4F29E3SG | Hersteller : Intel | FPGA Arria® 10 SX Family 270000 Cells 20nm Technology 0.9V 780-Pin FC-FBGA |
Produkt ist nicht verfügbar |
||
10AS027E4F29E3SG | Hersteller : Intel / Altera | SoC FPGA Arria 10 SX 270 SoC FPGA |
Produkt ist nicht verfügbar |