1109800-12 Aries Electronics

Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Programmable
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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Technische Details 1109800-12 Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD, Packaging: Bulk, Features: Programmable, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 12 (2 x 6), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.
Weitere Produktangebote 1109800-12
Foto | Bezeichnung | Hersteller | Beschreibung |
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1109800-12 | Hersteller : Aries Electronics |
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Produkt ist nicht verfügbar |