12-823-90C

12-823-90C Aries Electronics


13005-horizontal-display-socket-335797.pdf Hersteller: Aries Electronics
IC & Component Sockets VERT SOCKET
auf Bestellung 435 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+14.61 EUR
10+13.71 EUR
25+11.92 EUR
100+11.02 EUR
250+10.03 EUR
1000+9.06 EUR
2500+8.61 EUR
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details 12-823-90C Aries Electronics

Description: CONN IC DIP SOCKET 12POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 12 (2 x 6), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.

Weitere Produktangebote 12-823-90C

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
12-823-90C 12-823-90C Hersteller : Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH