| Anzahl | Preis |
|---|---|
| 1+ | 15.86 EUR |
| 10+ | 14.68 EUR |
| 25+ | 13.5 EUR |
| 50+ | 12.88 EUR |
| 100+ | 12.71 EUR |
| 250+ | 11.9 EUR |
| 500+ | 10.89 EUR |
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Technische Details 14-823-90 Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Weitere Produktangebote 14-823-90 nach Preis ab 11.96 EUR bis 17.67 EUR
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14-823-90 | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 14POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 314 Stücke: Lieferzeit 10-14 Tag (e) |
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