Hersteller: SkyRC
Netzteile und Ladegeräte > Ladegeräte (für Akku)
Beschreibung: Зарядний пристрій для зарядки і розрядки акумуляторів LiFe / Lilon / LiPo / LiHV / NiMH / NiCd / PB. Два входи живлення для: змінного / постійного струму. Захист: висока / низька вхідна напруга, захист від зворотної полярності входу / виходу. Bluetooth 5.0 для відстеження процесу зарядки на смартфоні. Метод заряду: CC / CV для літієвих та свинцевих (Pb) батарей. Дельта-пікова чутливість для NiMH / NiCd. Струм заряду: 0,1-10,0 А, струм розряду: 0,1-2,0 А, балансування: 1-6 комірок, балансний струм 1000 мА / комірку. Порти: 2-6S Balance Socket-XH, вхід для батареии: XT60, вхід постійного струму, вхід змінного струму.
U ein.: 10...30VDC/220VAC
Strom aus.: 10 A
Leistung: 200 W
Abmessungen: 112x75x38 mm
Варіант виконання: Розумний зарядний пристрій

Hersteller: ACV
Category: Facia Plates
Description: Radio frame; Kia; 2 DIN; matt black
Type of car audio accessories: radio frame
Application - car brand: Kia
Application - car model: Kia Cee'd (JD) 2012->2018; Kia Cee'd sw (JD) 2012->2018; Kia Pro Cee´d (JD) 2013->2018
Car audio accesories version: 2 DIN
Colour: matt black
Car Audio features: kit

Hersteller: ACV
Category: Facia Plates
Description: Radio frame; Kia; 2 DIN; matt black
Type of car audio accessories: radio frame
Application - car brand: Kia
Application - car model: Kia Cee'd (JD) 2012->2018; Kia Cee'd sw (JD) 2012->2018; Kia Pro Cee´d (JD) 2013->2018
Car audio accesories version: 2 DIN
Colour: matt black
Car Audio features: kit
Anzahl je Verpackung: 1 Stücke

Hersteller: Aces Connectors
Description: 0.5MM MXM-3 EDGE CARD CONN., SMT
Packaging: Cut Tape (CT)
Part Status: Active

Hersteller: STMicroelectronics
Description: IC EEPROM 128KBIT I2C 8UFDFPN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UFDFPN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 16K x 8
DigiKey Programmable: Not Verified

Hersteller: STMicroelectronics
Description: IC EEPROM 128KBIT I2C 8UFDFPN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UFDFPN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 16K x 8
DigiKey Programmable: Not Verified

Hersteller: Texas Instruments
Description: IC GATE AND 2CH 2-INP 8DSBGA
Packaging: Bulk
Package / Case: 8-XFBGA, DSBGA
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 2.7V
Current - Output High, Low: 9mA, 9mA
Number of Inputs: 2
Supplier Device Package: 8-DSBGA
Input Logic Level - High: 1.7V
Input Logic Level - Low: 0V ~ 0.7V
Max Propagation Delay @ V, Max CL: 1.6ns @ 2.5V, 30pF
Number of Circuits: 2
Current - Quiescent (Max): 10 µA

Hersteller: Phoenix Contact
Pluggable Terminal Blocks PC 5/ 3-ST1- 7,62 BK BD:U1,U2,1

Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

Hersteller: Preci-dip
IC & Component Sockets

Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

Hersteller: Preci-dip
Board to Board & Mezzanine Connectors

Hersteller: TE Connectivity AMP Connectors
Description: CONN SKT SODIMM 200POS R/A SMD
Packaging: Tray
Features: Board Guide, Latches
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Memory Type: DDR SDRAM
Height: 0.196" (4.00mm)
Card Thickness: 0.039" (1.00mm)
Connector Style: SODIMM
Contact Finish Thickness: FLASH
Mounting Feature: Reverse
Number of Positions: 200
Insertion Angle: 25° Angle

Hersteller: TE Connectivity
Conn SO DIMM Socket SKT 200 POS 0.6mm Solder ST SMD Tray

Hersteller: Aces Connectors
Description: 0.5MM MXM-3 EDGE CARD CONN., SMT
Packaging: Tape & Reel (TR)
Part Status: Active

Hersteller: Murata Electronics
Description: CAP CER 7.5PF 50V C0G/NP0 0402
Tolerance: ±0.25pF
Packaging: Tape & Reel (TR)
Voltage - Rated: 50V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Thickness (Max): 0.022" (0.55mm)
Part Status: Not For New Designs
Capacitance: 7.5 pF

Hersteller: Texas Instruments
Description: IC GATE AND 2CH 2-INP 8DSBGA
Packaging: Tape & Reel (TR)
Package / Case: 8-XFBGA, DSBGA
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 2.7V
Current - Output High, Low: 9mA, 9mA
Number of Inputs: 2
Supplier Device Package: 8-DSBGA
Input Logic Level - High: 1.7V
Input Logic Level - Low: 0V ~ 0.7V
Max Propagation Delay @ V, Max CL: 1.6ns @ 2.5V, 30pF
Number of Circuits: 2
Current - Quiescent (Max): 10 µA

Hersteller: Texas Instruments
Description: IC GATE AND 2CH 2-INP 8DSBGA
Packaging: Cut Tape (CT)
Package / Case: 8-XFBGA, DSBGA
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 2.7V
Current - Output High, Low: 9mA, 9mA
Number of Inputs: 2
Supplier Device Package: 8-DSBGA
Input Logic Level - High: 1.7V
Input Logic Level - Low: 0V ~ 0.7V
Max Propagation Delay @ V, Max CL: 1.6ns @ 2.5V, 30pF
Number of Circuits: 2
Current - Quiescent (Max): 10 µA