
17EBH026PAM010 Amphenol

Conn High Density D-Sub PIN 26 POS 1.14mm Solder RA Thru-Hole 26 Terminal 1 Port
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Technische Details 17EBH026PAM010 Amphenol
Description: CONN D-SUB HD PLG 26POS R/A SLDR, Packaging: Tray, Features: Board Lock, Grounding Indents, Connector Type: Plug, Male Pins, Contact Finish: Gold, Current Rating (Amps): 3A, Mounting Type: Through Hole, Right Angle, Number of Positions: 26, Number of Rows: 3, Contact Type: Signal, Flange Feature: Housing/Shell (Unthreaded), Termination: Solder, Connector Style: D-Sub, High Density, Contact Finish Thickness: 30.0µin (0.76µm), Material Flammability Rating: UL94 V-0, Shell Material, Finish: Steel, Nickel Plated, Shell Size, Connector Layout: 2 (DA, A) High Density, Backset Spacing: 0.350" (8.89mm).
Weitere Produktangebote 17EBH026PAM010
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17EBH-026-P-AM-0-10 | Hersteller : Amphenol ICC (Commercial Products) |
![]() Packaging: Tray Features: Board Lock, Grounding Indents Connector Type: Plug, Male Pins Contact Finish: Gold Current Rating (Amps): 3A Mounting Type: Through Hole, Right Angle Number of Positions: 26 Number of Rows: 3 Contact Type: Signal Flange Feature: Housing/Shell (Unthreaded) Termination: Solder Connector Style: D-Sub, High Density Contact Finish Thickness: 30.0µin (0.76µm) Material Flammability Rating: UL94 V-0 Shell Material, Finish: Steel, Nickel Plated Shell Size, Connector Layout: 2 (DA, A) High Density Backset Spacing: 0.350" (8.89mm) |
Produkt ist nicht verfügbar |
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17EBH-026P-AM010 | Hersteller : Amphenol Commercial Products |
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Produkt ist nicht verfügbar |