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20-1508-21

20-1508-21 Aries Electronics

aries_ares-s-a0001046192-1.pdf
Hersteller: Aries Electronics
IC & Component Sockets DUAL ROW COLLET WIRE WRAP 20 PINS
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+36.24 EUR
10+30.56 EUR
25+27.17 EUR
100+25 EUR
250+24.11 EUR
500+23.75 EUR
1000+23.23 EUR
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Technische Details 20-1508-21 Aries Electronics

Description: CONN IC DIP SOCKET 20POS GOLD, Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.2" (5.08mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Wire Wrap, Number of Positions or Pins (Grid): 20 (2 x 10).

Weitere Produktangebote 20-1508-21

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
20-1508-21 Aries Electronics 508_Series.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Wire Wrap
Number of Positions or Pins (Grid): 20 (2 x 10)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 32 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
20-1508-21 508_Series.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Wire Wrap
Number of Positions or Pins (Grid): 20 (2 x 10)
Produkt ist nicht verfügbar
Mindestbestellmenge: 32 Stücke
Im Einkaufswagen  Stück im Wert von  UAH