
20-1518-10 Aries Electronics
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 4.12 EUR |
10+ | 3.73 EUR |
25+ | 3.17 EUR |
100+ | 2.85 EUR |
250+ | 2.13 EUR |
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Technische Details 20-1518-10 Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.
Weitere Produktangebote 20-1518-10
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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20-1518-10 | Hersteller : Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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