20-823-90 Aries Electronics

Description: CONN IC DIP SOCKET 20POS GOLD, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Solder, Number of Positions or Pins (Grid): 20 (2 x 10), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Horizontal, Features: Closed Frame, Packaging: Bulk, Part Status: Active, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze.