20-823-90 Aries Electronics
Hersteller: Aries ElectronicsDescription: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 1096 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 22.4 EUR |
| 10+ | 19.86 EUR |
| 25+ | 19.1 EUR |
| 50+ | 18.33 EUR |
| 100+ | 17.32 EUR |
| 250+ | 15.79 EUR |
| 500+ | 14.77 EUR |
| 1000+ | 13.55 EUR |
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Technische Details 20-823-90 Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Weitere Produktangebote 20-823-90 nach Preis ab 15.22 EUR bis 23.11 EUR
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20-823-90 | Hersteller : Aries Electronics |
IC & Component Sockets VERTI SOCKET |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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