auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 53.05 EUR |
| 10+ | 50.76 EUR |
| 25+ | 45.92 EUR |
| 50+ | 44.97 EUR |
| 100+ | 42.06 EUR |
| 250+ | 41.45 EUR |
| 500+ | 41.24 EUR |
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Technische Details 208-PGM17059-10 Aries Electronics
Description: SOCKET, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 208, Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.
Weitere Produktangebote 208-PGM17059-10
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 208-PGM17059-10 | Hersteller : Aries Electronics |
Description: SOCKET Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 208 Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |