2132271831 Molex
Hersteller: Molex1.50mm Pitch CLIK Mate Wire to Board PCB Receptacle Dual Row Surface Mount Vertical 0.38um Gold Au Plating 18 Circuits Black
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Technische Details 2132271831 Molex
Description: CLIK-MATE1.5 DRVT SMT AU0.38 ETP, Features: Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 100VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 18, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Forked, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.059" (1.50mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Tin, Insulation Height: 0.346" (8.80mm), Number of Rows: 2.
Weitere Produktangebote 2132271831
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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|---|---|---|---|---|---|
| 2132271831 | Hersteller : Molex |
Description: CLIK-MATE1.5 DRVT SMT AU0.38 ETP Features: Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle Voltage Rating: 100VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 18 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Forked Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.059" (1.50mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Insulation Height: 0.346" (8.80mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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213227-1831 | Hersteller : Molex | Headers & Wire Housings CLIKMATE1.5 DRVT SMT AU0.38 ETP 18P BK |
Produkt ist nicht verfügbar |