Produkte > ARIES ELECTRONICS > 22-4508-31

22-4508-31 Aries Electronics

12017-open-frame-dip-collet-wire-wrap-socket.pdf Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben

Technische Details 22-4508-31 Aries Electronics

Description: CONN IC DIP SOCKET 22POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.4" (10.16mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 22 (2 x 11), Termination: Wire Wrap, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.

Weitere Produktangebote 22-4508-31

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
22-4508-31 22-4508-31 Hersteller : Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket-365163.pdf IC & Component Sockets OPEN FRAME COLLET WIRE WRAP 22 PINS
Produkt ist nicht verfügbar