24-3553-10 Aries Electronics
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 22.69 EUR |
| 10+ | 19.27 EUR |
| 20+ | 18.99 EUR |
| 50+ | 17.74 EUR |
| 100+ | 14.78 EUR |
| 200+ | 14.36 EUR |
| 500+ | 13.89 EUR |
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Technische Details 24-3553-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote 24-3553-10
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 24-3553-10 | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 24POS TINFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
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