auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 79.69 EUR |
| 10+ | 73.13 EUR |
| 20+ | 70.31 EUR |
| 50+ | 67.95 EUR |
| 100+ | 64.20 EUR |
| 200+ | 62.34 EUR |
| 500+ | 60.93 EUR |
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Technische Details 24-6554-16 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Nickel Boron, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 24-6554-16 nach Preis ab 60.82 EUR bis 80.15 EUR
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24-6554-16 | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 24POSPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 73 Stücke: Lieferzeit 10-14 Tag (e) |
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