24-6554-16 Aries Electronics
Hersteller: Aries ElectronicsDescription: CONN IC DIP SOCKET ZIF 24POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 73 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 78.34 EUR |
| 10+ | 66.58 EUR |
| 30+ | 61.62 EUR |
| 50+ | 59.44 EUR |
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Technische Details 24-6554-16 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Nickel Boron, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 24-6554-16 nach Preis ab 58.4 EUR bis 82.05 EUR
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24-6554-16 | Hersteller : Aries Electronics |
IC & Component Sockets DIP TEST SOCKET |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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