Produkte > IBM > 25EMPPC603E2BB200Z

25EMPPC603E2BB200Z IBM

IBMMS00394-1.pdf?t.download=true&u=5oefqw

Hersteller: IBM
Description: IC MPU 200MHZ 278FCPBGA
Packaging: Bulk
Package / Case: 278-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: PowerPC EM603e
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 278-FCPBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Active

auf Bestellung 217 Stücke:

Lieferzeit 21-28 Tag (e)

Anzahl	Preis ohne MwSt
9+	81.27 EUR

Mindestbestellmenge: 9

Produktrezensionen

Produktbewertung abgeben

Technische Details 25EMPPC603E2BB200Z IBM

Description: IC MPU 200MHZ 278FCPBGA, Packaging: Bulk, Package / Case: 278-BBGA, FCBGA, Mounting Type: Surface Mount, Speed: 200MHz, Operating Temperature: 0°C ~ 105°C (TJ), Core Processor: PowerPC EM603e, Voltage - I/O: 2.5V, 3.3V, Supplier Device Package: 278-FCPBGA (21x21), Number of Cores/Bus Width: 1 Core, 32-Bit, Graphics Acceleration: No, Part Status: Active.