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28-3554-11

28-3554-11 Aries Electronics

10001-universal-dip-zif-test-socket-337360.pdf Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 28 PINS
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+33.56 EUR
9+ 29.99 EUR
27+ 28.88 EUR
54+ 27.95 EUR
108+ 27.02 EUR
252+ 25.54 EUR
504+ 24.8 EUR
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Technische Details 28-3554-11 Aries Electronics

Description: CONN IC DIP SOCKET ZIF 24POS GLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 250°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Material - Post: Beryllium Copper, Part Status: Active.

Weitere Produktangebote 28-3554-11

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28-3554-11 Hersteller : Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
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