28-3554-11

28-3554-11 Aries Electronics


10001-universal-dip-zif-test-socket-337360.pdf Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 28 PINS
auf Bestellung 7 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+35.69 EUR
9+28.88 EUR
27+26.36 EUR
108+24.92 EUR
252+24.31 EUR
504+23.95 EUR
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details 28-3554-11 Aries Electronics

Description: CONN IC DIP SOCKET ZIF 24POS GLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 250°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Material - Post: Beryllium Copper, Part Status: Active.

Weitere Produktangebote 28-3554-11

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
28-3554-11 Hersteller : Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH