Produkte > ARIES ELECTRONICS > 28-6553-10*

28-6553-10* Aries Electronics


10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
IC & Component Sockets
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+31.42 EUR
9+24.36 EUR
27+23.34 EUR
54+22.91 EUR
108+21.55 EUR
252+20.78 EUR
504+20.48 EUR
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details 28-6553-10* Aries Electronics

Description: CONN IC DIP SOCKET ZIF 28POS GLD, Contact Material - Post: Beryllium Copper, Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.

Weitere Produktangebote 28-6553-10*

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
28-6553-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 45 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-6553-10 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 45 Stücke
Im Einkaufswagen  Stück im Wert von  UAH