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28-6553-10* Aries Electronics

10001-universal-dip-zif-test-socket-337360.pdf Hersteller: Aries Electronics
IC & Component Sockets
auf Bestellung 7 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
2+38.69 EUR
9+ 32.63 EUR
27+ 30.08 EUR
108+ 30.06 EUR
252+ 30.03 EUR
504+ 29.77 EUR
1008+ 29.48 EUR
Mindestbestellmenge: 2
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Technische Details 28-6553-10* Aries Electronics

Description: CONN IC DIP SOCKET ZIF 28POS GLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Material - Post: Beryllium Copper.

Weitere Produktangebote 28-6553-10*

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28-6553-10 Hersteller : Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
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