3-1571550-0 TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 32POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
| Anzahl | Preis |
|---|---|
| 2+ | 16.81 EUR |
| 15+ | 13.48 EUR |
| 30+ | 12.74 EUR |
| 60+ | 12.04 EUR |
| 105+ | 11.51 EUR |
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Technische Details 3-1571550-0 TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 32POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Tube.