3-1571550-0 TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP ConnectorsDescription: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 704 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 23.66 EUR |
| 10+ | 21.42 EUR |
| 25+ | 20.85 EUR |
| 50+ | 20.06 EUR |
| 100+ | 18.58 EUR |
| 250+ | 18.47 EUR |
| 500+ | 17.79 EUR |
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Technische Details 3-1571550-0 TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 32POS GOLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 3-1571550-0
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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3-1571550-0 | Hersteller : TE Connectivity |
Conn DIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole Box/Tube |
Produkt ist nicht verfügbar |