342941

342941 Boyd Laconia, LLC


Board_Level_Cooling_Square_Skived_Fin-3044617.pdf Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 40X40.5X13.5MM
Packaging: Tray
Material: Copper
Length: 1.594" (40.50mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.30°C/W
Fin Height: 0.531" (13.50mm)
Material Finish: AavSHIELD 3C
auf Bestellung 224 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+57.27 EUR
10+ 53.9 EUR
25+ 50.53 EUR
40+ 47.16 EUR
80+ 45.48 EUR
Produktrezensionen
Produktbewertung abgeben

Technische Details 342941 Boyd Laconia, LLC

Description: COPPER HEATSINK 40X40.5X13.5MM, Packaging: Tray, Material: Copper, Length: 1.594" (40.50mm), Shape: Square, Fins, Type: Top Mount, Skived, Width: 1.575" (40.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 13.30°C/W, Fin Height: 0.531" (13.50mm), Material Finish: AavSHIELD 3C.