Produkte > AAVID THERMALLOY > 371924B00032G

371924B00032G Aavid Thermalloy

Name: 371924B00032G
Brand: Aavid
SKU: 3440643-4
Price: 5.8 EUR
Availability: BackOrder

Hersteller: Aavid Thermalloy
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum Black Anodized

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Technische Details 371924B00032G Aavid Thermalloy

Description: 371924B00032G, Packaging: Bulk, Material: Aluminum, Length: 1.378" (35.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.378" (35.00mm), Package Cooled: BGA, FPGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 3.0W @ 60°C, Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM, Thermal Resistance @ Natural: 31.90°C/W, Fin Height: 0.551" (14.00mm), Material Finish: Black Anodized.

Weitere Produktangebote 371924B00032G

Bezeichnung	Hersteller	Beschreibung	Verfügbarkeit
371924B00032G	Hersteller : Boyd Corporation	Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum Black Anodized	Produkt ist nicht verfügbar
371924B00032G	Hersteller : BOYD CORP	Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 13.97mm Material: aluminium Length: 35mm Material finishing: anodized Colour: black Type of heatsink: extruded Application: BGA Width: 35mm Heatsink shape: grilled Height: 13.97mm Anzahl je Verpackung: 1 Stücke	Produkt ist nicht verfügbar
371924B00032G	Hersteller : Boyd Laconia, LLC	Description: 371924B00032G Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA, FPGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM Thermal Resistance @ Natural: 31.90°C/W Fin Height: 0.551" (14.00mm) Material Finish: Black Anodized	Produkt ist nicht verfügbar
371924B00032G	Hersteller : Aavid	Heat Sinks Pin Fin Heat Sink for BGA, FPGA, 35x35x14mm, T405R Chomerics Tape Metal Surface	Produkt ist nicht verfügbar
371924B00032G	Hersteller : BOYD CORP	Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 13.97mm Material: aluminium Length: 35mm Material finishing: anodized Colour: black Type of heatsink: extruded Application: BGA Width: 35mm Heatsink shape: grilled Height: 13.97mm	Produkt ist nicht verfügbar